Wafer Level Chip Scale Package (WLCSP) assemblies were tested under high temperature and high current conditions. Electromigration damage was observed along with accelerated diffusion and intermetallic compound growth at the solder / Under Bump Metallization (UBM) interface. Final electrical failure typically occurred due to a void created in the redistribution line (RDL) near the UBM. The fail...

Bayesian semi-parametric inference is considered for a log-linear model. This model consists of a parametric component for the regression coeecients and a nonparametric component for the unknown error distribution. Bayesian analysis is studied for the case of a parametric prior on the regression coeecients and a mixture-of-Dirichlet-processes prior on the unknown error distribution. A Markov ch...