ÐFree standing polycrystalline thin ®lms with a strong h111i texture were tested in uniaxial tension. Studied were electron-beam deposited Ag, Cu and Al ®lms, and Ag/Cu multilayers consisting of alternating Ag and Cu layers of equal thickness, between 1.5 nm and 1.5 mm (bilayer repeat length, l, between 3 nm and 3 mm). The ®lms had a total thickness of about 3 mm. A thin polymeric two-dimension...

In this work, thin films were deposited on the amorphous glass substrates by magnetron sputtering method. Surface morphology of double-layers of Ag/Al and Ag/Cu were investigated. For surface morphology studies atomic force microscope (AFM) and scanning electron microscopy (SEM) were used, variations of the grain and partical size as well as surface roughness, roughness exponents and correlatio...

We use plane-wave density functional methods to model Ge-Se-Ag-Cu liquids and glasses. The models are analyzed for structural and electronic properties and transition metal ion dynamics. Electronic properties are analyzed with the electronic density of states and projected density of states. The optical gap increases with increasing Ag content and decreases with increasing Cu content. We carry ...

Cu is an essential cofactor for at least twelve mammalian enzymes including dopamine beta-mono-oxygenase (DBM), which converts dopamine (DA) to noradrenaline (NA). Previous studies reported that certain Cu-deficient (Cu-) rat tissues have lower NA and higher DA than Cu-adequate (Cu+) tissues, suggesting that DBM function was impaired. However, in vitro studies suggested that DBM activity is hig...

Metal complexes of malonie acid (metal = Mn(II), Co(II), Ni(II), Cu(II), Zn(II), Ag(I)) were prepared and only the Ag(I) complex inhibited the growth of Candida albicans. Malonate complexes incorporating the chelating 1,10-phenanthroline (1,10-phen) ligand showed a range of activities: good (Mn(II), Cu(II), Ag(I)); moderate (Zn(II)); poor (Co(II), Ni(II)). Metal-free 1,10-phen and Ag(CH(3)CO(2)...

The possibility of alloying can not be avoided at the interface between molten brazing filler metal and base metal in brazing, so the wettability of brazing filler metal can not be easily explained theoretically. We used the original apparatus for wettability test and investigated the relation between the wettability of brazing filler metals of Ag-P-Cu and Ag-Cu-Zn-Cd systems on copper and the ...

High-power impulse magnetron sputtering (HiPIMS) was used to deposit ITO/Ag/ITO (IAgI) and ITO/Cu/ITO (ICuI) sandwiched films on polyethylene naphthalate substrate at room temperature as flexible transparent conductive materials. The hybrid layers were constructed with 40 nm ITO bottom top layers, a 5–20 Ag or Cu interlayer. microstructure optoelectrical properties estimated for these various t...

The adsorption properties of Shewanella xiamenensis immobilized on zeolite have been evaluated in order to determine its applicability for remediation silver-containing effluents with different chemical composition. effects pH (2.0–6.0), contact time (15–150 min), silver concentration (10–100 mg/L) and temperature (20–50 °C) the bio-zeolite efficiency were investigated batch experiments. optima...

The changes in microstructure and microhardness of Sn-0.5%Ag, Sn-1.0%Ag, and Sn-0.7%Cu Pb-free solders were investigated during high temperature aging at 200°C for 2 h. As-solidified microstructures, revealed by cross-polarized light microscopy, consist of relatively large grains of β-Sn phase with twinned microstructure in both Sn-Ag and Sn-Cu solders. The bright-field light microscopy display...