Ni and Cu elemental powder mixtures containing 25, 50, and 75% at Cu were subjected to mechanical alloying in a planetary ball mill under various milling times. Structural evolution was analyzed by means of X-ray diffraction and scanning electron microscopy. Experimental results indicated that nanostructured solid solution alloy powders having homogeneous distribution of Ni and Cu were formed b...

Biomedical materials can improve the life quality of a number of people each year. The range of applications includes such as joint and limb replacements, artificial arteries and skin, contact lenses, and dentures. So far the accepted biomaterials include metals, ceramics and polymers. The metallic biomaterials mainly contain stainless steel, Co-Cr alloys, Titanium and Ti-6Al-4V. Recently, bulk...

Ships transport about 80 percent of world trade and transfer approximately three to five billion tons of ballast water internationally every year. Due to the likely presence of pollutants, the ballast water discharged by ships can have negative effects on aquatic ecosystems. This study was conducted on 10 ships that entered the Bushehr port to determine the effectiveness of the ballast water ex...

The chemically crosslinked metal-complexed chitosans were synthesized by using the ion-imprinting method from a chitosan with four metals (Cu(II), Zn(II), Ni(II) and Pb(II)) as templates and glutaraldehyde as a crosslinker. The influences of adsorption conditions, including molar ratios of crosslinker/chitosan and pH changes, were studied. They were used to investigate for comparative adsorptio...

Here, we report the synthesis, characterization, and catalytic evaluation of Ni-Cu-Mg ferrite using tragacanth gum as biotemplate and Metals nitrate as the metal source by the sol-gel method without using any organic chemicals. The sample was characterized by powder X-Ray Diffraction (XRD), Fourier Transform Infrared Spectroscopy (FT-IR), Vibrating Sample Magnetometer (VSM), and Scanning El...

In this study, UBM material systems for flip chip solder bumps on Cu pads were investigated using the electroless copper (E-Cu) and electroless nickel (E-Ni) plating methods; and the effects of the interfacial reaction between UBMs and Sn–36Pb–2Ag solders on the solder bump joint reliability were also investigated to optimize UBM materials for flip chip on Cu pads. For the E-Cu UBM, scallop-lik...