Deog Ki Hong and Stephen D.H. Hsu 1 Department of Physics, Pusan National University, Pusan 609-735, Korea [email protected] 2 Department of Physics, University of Oregon, Eugene OR 97403-5203 [email protected] (Dated: June 4, 2005) Abstract We elaborate on previous results concerning the positivity of the Euclidean path integral measure for low-energy modes in dense fermionic matter. We ...

The purpose of this study was to quantitatively evaluate the effect of staining solutions by spectrophotometric method on color stability of the commercially available acrylic denture base resins polymerized by different methods of cure, materials, and immersion periods. Commercially available heat cure resin (Travelon) and self cure resin (RR repair material) were selected for the study. In ca...

The effect of wood flour on the cure kinetics of commercial phenol-formaldehyde resins used as oriented strandboard face and core adhesives was studied using differential scanning calorimetry. The wood flour did not change the cure mechanism of the face resin, but lowered its cure temperature and activation energy and increased its cure reaction order. For the core resin (CR), the wood flour lo...

We give a rigorous analysis of variations of the contact process on a finite graph in which the cure rate is allowed to vary from one vertex to the next, and even to depend on the current state of the system. In particular, we study the epidemic threshold in the models where the cure rate is proportional to the degree of the node or when it is proportional to the number of its infected neighbors.