This paper describes an ultra precision polishing method of aspherical mirrors, and the fundamental research on polishing characteristics. The aspherical mirrors with a diameter of about 30mm made by fused silica glass and CVD-SiC were ELID (electrolytic in-process dressing)-ground to high form accuracy with #4000 cast iron bonded diamond wheel, and then polished with a small polishing tool. As...

Ductile iron is one of the most important engineering materials, in view of its excellent castability, signifi cantly better mechanical properties and low cost [1, 2]. It represents the fastest growing segment of the iron market. In the medium term, it is to be expected that the market share of nodular iron will level off at 40 % to 45 % [3]. Achieving the full potential of ductile iron require...

Recent developments in grinding have opened up new avenues for finishingof hard and brittle materials with Nano-surface finish, high tolerance and accuracy.Grinding with super abrasive diamond wheels is an excellent way to produce ultraprecision surface finish. However, super abrasive diamond grits need higher bondingstrength while grinding, which metal-bonded grinding wheels ca...

conputer pror,rae1 descrihed for practical optinization plun?;e grindin>; on steels. Tl1e program based on a strategy desiv,ned to o;Hi!'1ize both the grinding and dress "~nr, <Jara!'1eters maxil'1um metal removal rate, to constraints of surface finish and burning of the Forkpiece. The operates with a desktop micro-computer. performin?: the optimization, the user inputs the present grinding dre...

A on-line monitoring new method for grinding quality is presented based on theory analysis and test study, which collects the information of grinding quality from the AE signals produced by friction and grinding process to realize the on-line intelligent detection and prediction of grinding quality by A wavelet neural network & Fuzzy BP algorithm based network. The reliability and feasibility o...

The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two oth...

Surface roughness is a variable often used to describe the quality of ground surfaces as well as to evaluate the competitiveness of the overall grinding system. The subject of this paper is a grinding process performed on P20 tool steel by changing the grinding conditions, including the depth of cut, the grinding passes, the type of wheel, and the cutting fluid supply in the experiment. The mai...

The quality and economy of grinding depend on proper selection of grinding conditions for the materials to be ground. In order to evaluate the effect of heavy-duty grinding, a new performance index, which includes specific material removal rate, size accuracy, and grinding forces, was proposed. Robust design of experiment, including orthogonal arrays, the signal-to-noise ratio (SNR) method, and...

While a freestanding high-strength sheet metal subject to tension will rupture at a small strain, it is anticipated that lamination with a ductile sheet metal will retard this instability to an extent that depends on the relative thickness, the relative stiffness, and the hardening exponent of the ductile sheet. This paper presents an analytical study for the deformability of such laminate with...