An Adsorbent based treatment system is presented for toxic metal removal from rinsewater streams. The adsorbent is a Mg-A1 oxide anion exchange material with high capacity (approaching 5.5 meq/g) and strong selectivity for difficult to treat species such as Electroless plating metal chelates, Fixed Cyanides and chrome conversion solutions. Data is presented describing treatment of various metal...

We report the first investigation into the potential of electroless nickel deposition to form ohmic contacts on single layer graphene. To minimize the contact resistance on graphene, a statistical model was used to improve metal purity, surface roughness, and coverage of the deposited film by controlling the nickel bath parameters (pH and temperature). The metalized graphene layers were pattern...

Shape- and size-controlled syntheses of metal nanoparticles have been achieved by galvanic displacement reaction between an aqueous solution of metal salt and Cu foil substrate. In particular, cubic and spheric nanoparticles of Pt (Au) with a fairly narrow size distribution were produced by reacting K(2)PtCl(4) (HAuCl(4)) with a Cu foil in an aqueous medium with and without CuCl(2) under differ...

Via electroless metal deposition, well-defined silver dendrites and thin porous silicon (por-Si) layers are simultaneously prepared in ammonia fluoride solution containing AgNO3 at 50 C. A self-assembled localized microscopic electrochemical cell model and a diffusion-limited aggregation mode are used to explain the growth of silver dendrites. The formation of silver dendritic nanostructures de...

An on-column metal coating procedure was developed for sheathless electrospray emitters, based on Justus von Liebig's electroless silver mirror reaction followed by electrochemical deposition of gold onto the silver layer. The coating procedure is straightforward, mild, inexpensive, and can be performed with standard laboratory equipment. A long-term (600 h) stability investigation of the condu...

Electroless deposition for fabricating copper Cu interconnects of integrated circuits has drawn attention due to its low processing temperature, high deposition selectivity, and high coverage. In this paper, three-dimensional computer simulations of the qualitative growth properties of Cu particles and two-dimensional simulations of the trench-filling properties are conducted. The mathematical ...

We report on the fabrication and morphology/structural characterization of a porous anodic alumina (PAA)/PtSi nano-template for use as matrix in template-assisted Si nanowire growth on a Si substrate. The PtSi layer was formed by electroless deposition from an aqueous solution containing the metal salt and HF, while the PAA membrane by anodizing an Al film deposited on the PtSi layer. The morph...

The successful synthesis of carbon nanotubes has stimulated much research in nanomaterials, in particular, in semiconducting nanostructures, which are interesting for their novel sizeand dimensionality-dependent physical properties, and their potential applications in nanoscale optoelectronics. Silicon is the most important semiconducting material, with its contemporary microelectronic technolo...