Chemical–mechanical polishing (CMP) is a planarization process that utilizes chemical reactions and mechanical material removal using abrasive particles. With the increasing integration of semiconductor devices, CMP gaining importance in manufacturing. Abrasive-free (AF-CMP) uses solutions do not contain particles to reduce scratches improve capabilities. However, because AF-CMP does use for re...

In the process of form control using bonnet polishing an influence function is of vital importance for establishing material removal rates. However, the effects of polishing cloth, workpiece hardness and polishing parameters (such as precess angle, head speed, tool pressure and tool offset) on influence function when polishing CoCr alloys are not yet established and these factors affect the det...

Recently, the magnetorheological (MR) polishing process has been examined asa new ultra-precision polishing technology for micro parts in MEMS applications. In theMR polishing process, the magnetic force plays a dominant role. This method uses MRfluids which contains micro abrasives as a polishing media. The objective of the presentresearch is to shed light onto the material removal mechanism u...

The polarisation characteristics of the electropolishing process in a magnetic field (MEP – magnetoelectropolishing), in comparison with those obtained under standard/conventional process (EP) conditions, have been obtained. The occurrence of an EP plateau has been observed in view of the optimization of MEP process. Up-to-date stainless steel surface studies always indicated some amount of fre...

A systematic study is presented on the superconductivity (sc) parameters of the ultrapure niobium used for the fabrication of the nine-cell 1.3 GHz cavities for the linear collider project TESLA. Cylindrical Nb samples have been subjected to the same surface treatments that are applied to the TESLA cavities: buffered chemical polishing (BCP), electrolytic polishing (EP), low-temperature bakeout...

Through a systematic experimental investigation into the polishing of polycrystalline diamond composites by the dynamic friction technique, this paper identified three major regimes of polishing conditions: the regime capable of a low material removal, that enabling a safe, high removal processing, and that of an unsafe but ultra-high material removal. The study concluded that a higher polishin...

In order to obtain well-proportioned surface quality and high polishing efficiency of free-form mould, a robotic gasbag polishing technique using an improved spinning-inflated-gasbag polishing tool is proposed in this paper. The improved polishing tool consists of three detachable modules, which are the drive, soft rubber gasbag and magnetorheology. The six degrees of freedom industrial robot w...

In the moulds and dies manufacturing it is important to reduce the manual polishing time after end milling processes. The polishing difficulty is related to surface topography shape and roughness values obtained in the previous end milling processes. It is interesting to develop a methodology and a test to evaluate the polishing difficulty. The aim of the present work is to establish a methodol...