نتایج جستجو برای: gas diffusion layer

تعداد نتایج: 666194  

2011
Jun‐Hong Liang James C. McWilliams Peter P. Sullivan Burkard Baschek

[1] We report on the development of a bubble concentration model and a dissolved gas concentration model for the oceanic boundary layer. The bubble model solves a set of concentration equations for multiple gases in bubbles of different sizes, and the dissolved gas concentration model simulates the evolution of dissolved gases and dissolved inorganic carbon. The models include the effects of ad...

2004
P Brault A Caillard A L Thomann J Mathias C Charles R W Boswell S Escribano J Durand T Sauvage

Platinum is deposited into porous carbon materials relevant for fuel cell electrodes using plasma sputtering techniques. The resulting platinum concentration profile extends up to 2μm into the porous carbon and is well fitted by a generalized stretched Gaussian function, which displays the non-thermal nature of the penetration process. Platinum deposits are observed to grow as clusters. On the ...

2007
S.Y.Y. Leung D. Nikezic K. N. Yu

Solid-state nuclear track detectors (SSNTDs) in diffusion chambers have been routinely used for long-term measurements of radon gas concentrations. In usual practice, a filter is added across the top of the diffusion chamber to stop the progeny from entering. Thoron can also be deterred from entering the diffusion chamber by using a polyethylene (PE) membrane. However, the thickness of the PE m...

Journal: :TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B 2007

Journal: :TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B 2005

Journal: :Nanoscale 2014
Juree Hong Sanggeun Lee Seulah Lee Heetak Han Chandreswar Mahata Han-Wool Yeon Bonwoong Koo Seong-Il Kim Taewook Nam Kisik Byun Byung-Wook Min Young-Woon Kim Hyungjun Kim Young-Chang Joo Taeyoon Lee

The evolution of copper-based interconnects requires the realization of an ultrathin diffusion barrier layer between the Cu interconnect and insulating layers. The present work reports the use of atomically thin layer graphene as a diffusion barrier to Cu metallization. The diffusion barrier performance is investigated by varying the grain size and thickness of the graphene layer; single-layer ...

Journal: :TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B 1985

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