In the recent years, hardware trojans have become a serious issue in the field of integrated circuits. Our work presents a framework for hardware trojan detection in wireless cryptographic integrated circuits. It deals with the leaking of secret information through a wireless communication, using a mixed-signal integrated circuit technique. A trojan is inserted in the introduced system, which d...

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Electronics are used in modern oil and gas exploration to collect, log, and/or process data such as heading and inclination, weight on the bit, vibration, seismic/acoustic response, temperature, pressure, radiation, and resistivity of the strata. High-temperature electronics are needed that can reliably operate in deep-well conditions (up to 250°C). The U.S. Department of Energy Deep Trek progr...

The reliability of an integrated circuit (IC) is a strong function of temperature. In this study, we developed domputer-aided design tools to predict the temperature distribution of an IC die and compared it with thermal maps obtained by infrared (IR) imaging. A temperature sensor array fabricated on test chips was used to measure the actual surface temperature of an IC die., This array was use...

Since the early 1980s, CAPP has been expected to bridge the gap between CAD and CAM. Though numerous research works on CAPP have been reported, it is not easy to ®nd a commercial CAPP system applicable to complicated objects with freeform shapes such as mold and die. The dependency on CAM system is holding one leg of CAPP, while the complexity of the solution space in freeform shape machining h...

This paper presents a high-quality and area-efficient ramp generator to be used for on-chip testing of analog and mixed-signal circuits. An original adaptive scheme is developed to palliate the inaccuracy of a basic ramp generator. As a result, the proposed adaptive ramp generator exhibits very good performances in terms of slope precision and ramp linearity while maintaining a low area overhead.

An alternative approach for evaluating the efficiency of integrated circuit (IC) design firms is presented in this paper. We took into account the differences between technology groups, containing one or more design firms, and input and output factors to prevent influences of scale (e.g., firm size). Specifically, we employed a directional distance function approach to data envelopment analysis...