Providing a minimum of theory, this review focuses on practical aspects analyzing the kinetics nonisothermal crystallization as measured with differential scanning calorimetry (DSC). It is noted that kinetic analysis dominated by approaches based Avrami and Arrhenius equations. Crystallization should not be considered synonymous model, whose applications are subject to very restrictive assumpti...

Abstract Non-isothermal reaction mechanism and kinetic analysis for the synthesis of monoclinic lithium zirconate (m-Li 2 ZrO 3 ) were investigated by processing TG-DTA, along with XRD, DLS, HRTEM. For this purpose, solid-state Li CO was carried out TG-DTA at different heating rates (10, 20, 30 °C/min) from room temperature to 1100 °C. The thermal data used calculate parameters two types isocon...

Thermal degradation behavior, exothermic patterns, and kinetic parameters of symmetrically/asymmetrically substituted polysilanes during the kumada thermal rearrangement in temperature range 100–450 °C, were investigated applying thermogravimetric (TGA) differential scanning calorimetric (DSC) techniques. Three kinds polysilanes, viz., Polydimethylsilane (PDMS), Polydiphenylsilane (PDPS) Polyme...

Carica papaya L. is frequently found in northern and northeastern Brazil, the Caribbean Central America. The seed oil was extracted using Soxhlet extraction. Its has low acidity, iodine index, saponification peroxide values adequate comparable to other commercially available vegetable oils. lipid profile of this also obtained by gas chromatography; thermal characterization performed thermogravi...

Carbohydrates as a component in adhesive formulations have been reported for many years. A rapid cure at moderate temperatures is remaining challenge the development of renewable adhesives. Rheology provides insight into all stages structure formation cured polymer. This work analyses curing carbohydrate-amine adhesives with and without addition 5-hydroxymethylfurfural (HMF) biomass-derived key...

40% of ultrapure silicon is lost as kerf during slicing to produce wafers. Kerf is currently not being recycled due to engineering challenges and costs associated with removing its abundant impurities. Carbon left behind from the lubricant remains as one of the most difficult contaminants to remove in kerf without significant silicon oxidation. The present work enables to better understand the ...