نتایج جستجو برای: large scale ststen

تعداد نتایج: 1402390  

1994
Mário Jorge Silva Randy H. Katz Mário J. Silva

Active Documentation for VLSI Design

Journal: :IEICE Transactions 2008
Hidenori Ohta Toshinori Yamada Chikaaki Kodama Kunihiro Fujiyoshi

A 3D-dissection (A rectangular solid dissection) is a dissection of a rectangular solid into smaller rectangular solids by planes. In this paper, we propose an O-sequence, a string of representing any 3Ddissection which is dissected by only non-crossing rectangular planes. We also present a necessary and sufficient condition for a given string to be an O-sequence. key words: rectangular solid d...

2011
Jacob A. Abraham Muhammad Mudassar Nisar Emil Gizdarski Ananta K. Majhi Donghwi Lee Erik Chmelar Edward J. McCluskey Rajesh Tiwari Abhijeet Shrivastava Mahit Warhadpande Srivaths Ravi Zhaoliang Pan Melvin A. Breuer Srikanth Venkataraman Sunghoon Chun Taejin Kim Yongjoon Kim Sungho Kang Sreejit Chakravarty Narendra Devta-Prasanna Sudhakar M Reddy Irith Pomeranz James W. Tschanz Gurgen Harutunyan Valery Vardanian Niladri Narayan Mojumder Saibal Mukhopadhyay Jae-Joon Kim Ching-Te Chuang

2000
Xing Zhou Khee Yong Lim

This paper presents a novel approach to formulating compact I−V models for deep-submicron MOS technology development. The developed model is a one-region closedform equation that resembles the same form as the longchannel one, which covers full range of channel length and bias conditions. Model parameter extraction follows a oneiteration prioritized sequence with minimum measurement data, and c...

1998
Seiichiro Yamaguchi Hiroshi Goto

| Inverse modeling is a promising approach to know device structures made in experiments. We show our inverse modeling approach and its e ciency by demonstrating accurate extraction of deep submicron MOSFET structures. We also show that our approach can predict device performance to optimize its structure for required speci cation.

Journal: :IEEE Trans. on CAD of Integrated Circuits and Systems 1988
Erich Barke

A comparison is made between various approximations of the line-to-ground capacitance problem in a VLSI environment. It is shown that with up-to-date dimensions, the simple parallel-plate model is no longer adequate. However, easy-to-use and fast-to-compute formulas exist that result in accurate and reliable capacitance values. The parasitic capacitance problem is three-dimensional by nature. T...

1994
Wayne H. Wolf

Of course, from childhood to forever, we are always thought to love reading. It is not only reading the lesson book but also reading everything good is the choice of getting new inspirations. Religion, sciences, politics, social, literature, and fictions will enrich you for not only one aspect. Having more aspects to know and understand will lead you become someone more precious. Yea, becoming ...

2016
Sandeep Sharma Dharmendra Verma

This paper reviewed the comparison between different clock distribution schemes which used for low power VLSI design which are the most important aspect in the industry. The main clock distribution schemes are single driver clock scheme and distributed buffers clock scheme. There are different tradeoffs in both the techniques such as size of buffers, number of buffers etc.

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