An accurate estimate of thermal stresses in multilayered microelectronics structures along the bonded interfaces is crucial for design and prediction of delamination-related failures. Compared with a numerical method, analytical closed-form solution can offer a more rapid method to obtain the stresses at the interfaces. An analytical model for ply-level sub-laminate analysis is investigated in ...

in this paper, the free vibration response of a laminated composite rectangularplate supporting a rotating circular patch mass is studied. the two variable refined platetheory that employs only two unknown functions as against three in the case of simpleshear deformation theory is applied to define the third order displacement field of acomposite rectangular plate. the plate is considered to ha...

An investigation into the dynamic characterisation of a rectangular flexible plate structure is presented and a simulation algorithm characterising the behaviour of the plate is developed using finite difference methods. A thin, rectangular plate, with all edges clamped, is considered. The investigation is accomplished by varying the width over the length ratio of the plate. The algorithm is im...

This paper presents a differential quadrature solution for analysis of transverse vibrations of non-homogeneous rectangular orthotropic plates of linearly varying thickness resting on Winkler foundation. Following Lévy approach i.e. two parallel edges are simply supported, the governing equation of motion has been solved for three different combinations of clamped, simply supported and free bou...