نتایج جستجو برای: soldering

تعداد نتایج: 2525  

Journal: :iranian journal of medical physics 0
mohammad sadegh nourbakhsh assistant professor, department of materials, faculty of engineering, university of semnan, semnan, iran mohammad etrati khosroshahi professor, laser and nanobiophotonics lab., faculty of biomedical engineering , amirkabir university of technology, tehran, iran

introduction: laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. to overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric cor...

2011
Farnaz Fattahi Milad Motamedi

BACKGROUND AND AIMS In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. MATERIALS AND METHODS Based on ADA/ISO 9693 specifications...

2007
Tsung-Nan Tsai

Surface mount technology (SMT) is one of the most important developments in electronic industry. A surface mount assembly (SMA) has three consecutive manufacturing steps: solder paste stencil printing, component placement, and solder reflow. Stencil printing process (SPP) involves highly operation complexity and has multiple quality characteristics, and averagely accounts for 60% of soldering d...

2011
Cristhiane Ristum BAGATIN Izabel Yoko ITO Marcela Cristina Damião ANDRUCIOLI Paulo NELSON-FILHO José Tarcísio Lima FERREIRA

OBJECTIVES The purpose of this study was to evaluate in situ the occurrence of corrosion in the soldering point areas between the wire, silver brazing and band in Haas expanders. MATERIAL AND METHODS Thirty-four 7-12-year-old patients who needed maxillary expansion with a Haas expander were randomly assigned to two groups of 17 individuals each, according to the oral hygiene protocol adopted ...

Journal: :Microelectronics Reliability 2012
Ming-Hung Shu Bi-Min Hsu Min-Chuan Hu

As from July 1, 2006, the European Union officially enforced prohibition of the use of six designated hazardous substances under the restriction of hazardous substances (RoHSs), including lead, cadmium and others. In addition, as from 2008, the requirements of green products had been made stricter by adding prevented use of halogen as the standard. When confronted with the two harsh lead-free a...

Journal: :Appl. Soft Comput. 2016
Tsung-Nan Tsai Mika Liukkonen

Solder paste is the main soldering material used to form strong solder joints between printed circuit boards (PCB) and surface mount devices in the surface mount assembly (SMA). On average 60% of endof-line soldering defects can be attributed to inadequate performance of solder paste stencil printing. Recently, lead-free solder paste has been adopted by electronics manufacturers in compliance w...

Journal: :Microelectronics Reliability 2010
Olivér Krammer Bálint Sinkovics

In this paper an improved method has been presented to determine the solder joint shear strength of passive discrete surface mounted (SMD) chip components (like resistors and capacitors). To calculate the stress in a solder joint in the case of shear loading, the force applied should be measured and the amount of joined surface (wetted area of the component metallization) calculated. Using the ...

2013
Pradeep Kumar Sandhya Kamat

-Multilayer ceramic chip capacitor CDR-05 (MIL part number) is one of the most used parts in ISRO’s satellite program. Cracks evolved in ceramic chip capacitors CDR-05 (size: 1825and dielectric: X7R) of two different makesduring soldering process are studied in this paper. It has been observed that CDR-05 capacitors of one particular make (Manufacturer-A) more prone to crack during soldering on...

2015
Morgana Ribas Anil Kumar Ranjit Pandher Rahul Raut Sutapa Mukherjee Siuli Sarkar

We present here the findings of Alpha’s Alloy Development Program on the next generation of low temperature alloys that can be used in reflow soldering temperatures from 170 to 200C. Approaches in alloy development, test methodologies and results are discussed. The alloy properties targeted for improvements include: Alloy strength, alloy ductility, microstructure stability, improvements in ther...

Journal: :Skull base : official journal of North American Skull Base Society ... [et al.] 2007
Boaz Forer Tamar Vasileyev Ziv Gil Tamar Brosh Naam Kariv Abraham Katzir Dan M Fliss

BACKGROUND AND OBJECTIVES The purposes of this study were to demonstrate that laser soldering is safe and effective for tissue bonding in dural reconstruction and to compare this new reconstruction technique to an established one. STUDY DESIGN A temperature-controlled fiberoptic CO(2) laser system or fibrin glue were used for in vitro dural defect reconstruction in two groups of pigs. The CO(...

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