Next generation wireless communiaction terminals will demand the use of advanced component integration process and high density packaging technologies in order to reduce size and to increase performance. The ability of the MCM-D low-cost Large Area Panel Processing technology to provide controlled impedance, microstrip, coplanar structures and integrated thin film passive components with useful...

Abstract—In this paper, a fast integral equation method is developed for extracting the inductances in RF ICs, RF MEMs, IC packages, and deep submicron ICs etc. This method combines a recently developed Multilevel Green’s Function Interpolation Method (MLGFIM) [1, 2] with the volume integral equation discretized using Volume Loop (VL) basis functions. In it, instead of using the filaments model...

This review of design principles for implementation of a spiral inductor in a silicon integrated circuit fabrication process summarizes prior art in this field. In addition, a fast and physics-based inductor model is exploited to put the results contributed by many different groups in various technologies and achieved over the past eight years into perspective. Inductors are compared not only b...

A wide-band physical and scalable 2equivalent circuit model for on-chip spiral inductors is developed. Based on physical derivation and circuit theory, closed-form formulas are generated to calculate the RLC circuit elements directly from the inductor layout. The 2model accurately captures ( ) and ( ) characteristics beyond the self-resonant frequency. Using frequency-independent RLC elements, ...