In this chapter, nanostructures templated by polymer microbead, which is usually made of polystyrene with a diameter range of 300 nm–1 μm, are reviewed. We first focus on formation of the microbead monolayer in terms of the driving force for self-assembly, the junction among the neighbouring microbeads and the uniformity of microbead monolayer. Then, we discuss applications of microbead monolay...

A Introduction Research and manufacturing related to silicon devices, circuits, and systems often relies on the wet-chemical etching of silicon wafers. The dissolution of silicon using liquid solutions is needed for deep etching and micromachining, shaping, and cleaning. Also, wet-chemistries are often used for defect delineation in single crystal silicon materials. In this paper, a review of t...

Out-of-plane polyimide (PI) electromagnetic microactuators with different geometries are designed, fabricated and tested. Fabrication of the electromagnetic microactuators consists of 10 lm thick Ni/Fe (80/20) permalloy deposition on PI diaphragm by electroplating process, electroplating of copper planar coil with 10 lm thick, bulk micromachining, and excimer laser selective ablation. They are ...

Wafer backside processing steps that include high temperature exposure may now be simplified with the use of a thermally resistant adhesive, GenTak 330. Processing at temperatures of 200oC and beyond are accepted to include plasma etching, deposition, and the curing of related polymers, such as BCB. By combining the thermoset properties of GenTak 330 with the dissolution characteristics of GenS...

The main priority of rubber dam isolation was endodontic isolation against fluids and microorganisms in the oral cavity. Added to this, is the need to protect the patient against accidental aspiration or ingestion of small endodontic instruments. According to court ruling in many countries, such occurrences are considered avoidable, and can be attributed to negligence on the part of the dentist...

Sputter probes are a promising method for injecting controlled quantities of metallic elements inside ECRIS, provided that the sputter rate can be controlled, so that high charge states and low sample consumption rate will be attained. Moreover pressure at the probe and inside the source should be different. With a sputter probe distance of 25 mm from ECRIS plasma, a 200 nA current of Sn was ea...

We present differential sputter yield measurements of boron nitride due to bombardment by xenon ions. A four-grid ion optics system is used to achieve a collimated ion beam at low energy (<100 eV). A quartz crystal microbalance (QCM) is used to measure differential sputter yield profiles of condensable components from which total sputter yields can also be determined. We report total and differ...

Dielectric layers are often employed as etch masks for mesa and trench structures during vertical-cavity surface-emitting laser VCSEL fabrication. The removal of these mask layers by reactive ion etching results in unavoidable exposure of the top laser facet to sputtering. This sputtering is experimentally shown to impact the device performance. After a thickness of less than a quarter waveleng...

Metal sputter deposition processes for semiconductor manufacturing are characterized by a decrease in deposition rate from run to run as the sputter target degrades. The goal is to maintain a desired deposition thickness from wafer to wafer and lot to lot. Run by run (RbR) model-based process control (MBPC) has been applied to metal sputter deposition processes at Texas Instruments. RbR MBPC, b...