The importance of power cycling as a mean of reliability assessment was revisited for flip chip plastic ball grid array (FC-PBGA) packages. Conventionally, reliability was addressed empirically through accelerated thermal cycling (ATC) because of its simplicity and conservative nature of life prediction. It was well accepted and served its role effectively for ceramic packages. In reality, an a...

The synthesis of iron oxide nano-particles by direct thermal decomposition was studied. Simultaneous thermal analysis and Fourier transform infrared spectroscopy results confirmed the formation of iron-urea complex, and disclosed iron oxide formation mechanism. Calcination of the iron-urea complex at 200°C and 250°C for 2 hrs. resulted in the formation of maghemite along with hematite as a seco...

Glue is widely used to improve the reliability of ball grid array (BGA) under mechanical shock and vibration. Although it has been demonstrated to have a positive effect on the reliability of BGA under mechanical impact, it can have adverse effects on BGA under thermal cycling. This paper investigates the effect of glue on the reliability of BGA under thermal cycling using both experimental and...

Purpose The main purpose of this study was to investigate if drinking ad-libitum can counteract potential negative effects of a hypohydrated start during a 40-km time trial in the heat. Methods Twelve well-trained males performed one 40-km cycling time trial while starting euhydrated (EU: no water during the time trial) and two 40-km cycling time trials while starting hypohydrated. During one h...

The aim of the study was to evaluate the core veneer bond strength of graded zirconia combinations and compared those to conventional zirconia combinations after thermal and mechanical tests. Conventional zirconia-veneer combinations and graded zirconia-veneer combinations were made into cylinders. Prior to shear bond testing, half of each group was subjected to thermal and mechanical cycling t...

We present here the findings of Alpha’s Alloy Development Program on the next generation of low temperature alloys that can be used in reflow soldering temperatures from 170 to 200C. Approaches in alloy development, test methodologies and results are discussed. The alloy properties targeted for improvements include: Alloy strength, alloy ductility, microstructure stability, improvements in ther...

Quantum dots have experienced rapid development in imaging, labeling and sensing in medicine and life science. To be suitable for polymerase chain reaction (PCR) assay, we have tested QD thermal cycling durability and compatibility, which have not been addressed in previous reports. In this study, we synthesized CdSe/ZnS QDs with a surface modification with high-MW amphiphilic copolymers and ob...