When detecting a target over the diurnal cycle, a conventional infrared thermal sensor might lose the target due to the thermal crossover, which could happen at any time throughout the day when the infrared image contrast between target and background in a scene is indistinguishable due to the temperature variation. In this paper, the benefits of using a multispectral-based infrared sensor over...

This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on ChipLaminate-Chip (CLC) technology. Internal IO interface inside CLC module has been modeled and compared with Stack-Chip (SC) implementation. Thermal analysis, including comparison against Stack-Chip and System-ona-Chip (SoC) is also presented. It is dem...

An approach for thermal simulation and reliability evaluation of MCM film resistors is described. Result can be used to reach an optimal solution based on available data, technology, topology and material parameters. To achieve a high reliability level and performance of the resistors, the board must be designed taking into account the thermal consideration for each component. Result of thermal...