In a 3D stacked IC, through-silicon vias (TSVs) are utilized to interconnect dies vertically. In one common TSV practice, via-first TSVs directly connect the first metal layer of a die and the top metal layer of the die above it. However, the landing pads on the first metal layer, due to their large area and presence of features with widely varying sizes, may result in serious topographic error...

AIM To investigate the therapeutic potential of tesevatinib (TSV), a unique multi-kinase inhibitor currently in Phase II clinical trials for autosomal dominant polycystic kidney disease (ADPKD), in well-defined rodent models of autosomal recessive polycystic kidney disease (ARPKD). METHODS We administered TSV in daily doses of 7.5 and 15 mg/kg per day by I.P. to the well characterized bpk mod...

1. Introduction As the size of transistor keeps shrinking, advance of CMOS technology becomes more difficult and will eventually reach the physical limitation. To continuously reduce the form factor of the system with multiple chips, one straight forward solution is using stacked dies, called three-dimensional integrated circuits (3D IC). Recently, the technology of Through Silicon Vias (TSVs),...

This paper reports on an investigation to determine whether through-focus scanning optical microscopy (TSOM) is applicable to micrometer-scale through-silicon via (TSV) reveal metrology. TSOM has shown promise as an alternative inspection and dimensional metrology technique for FinFETs and defects. In this paper TSOM measurements were simulated using 546 nm light and applied to copper TSV revea...

Taura syndrome virus (TSV) has caused major economic losses to shrimp aquaculture throughout the world. TSV has been reported to infect a number of penaeid species as hosts. In this study, we reported the natural infection of TSV in farm-reared Penaeus monodon from eastern provinces of Thailand between June to September 2004. There were different degrees of disease outbreak severity. In some ca...

The propagation delay of a logic signal through a through silicon via (TSV) in a 3D IC may depend on a soft open defect inside it. The propagation delay of a defective TSV which is connected only with barrier metal, in part owing to a soft open defect, is analyzed with an electromagnetic simulator and a circuit one in this paper. The results reveal that if such a soft open defect occurs inside ...

A Support Vector Machine (SV M) is a powerful classifier method, already used in many problems, which can be viewed as a convex optimization. In recent years, a considerable attention has been given on semi-supervised learning, differing from traditional supervised learning by making use of unlabelled data. In fact, in many applications like text categorization, collecting labelled examples may...

Purpose: To compare postoperative anatomical sclerotomy sites of transconjunctival sutureless vitrectomy (TSV) with conventional 20-gauge vitrectomy Methods: In this prospective, nonrandomized study 30 consecutive patients divided in 2 groups: group I, 15 eyes from 15 patients underwent conventional 20-gauge and group II, 15 eyes from 15 patients underwent TSV (23, 25-gauge) pars plana vitrecto...

This paper presents a novel on-chip passive bandpass filter for millimeter-wave (MMW) applications that utilizes a pair of electrically-coupled thru-silicon vias (TSV). The presented TSV bandpass filter can be used in MMW applications such as radar, medical imaging, and communication. The TSV bandpass filter uses two TSVs to extend two electrically-coupled conductors into the silicon substrate ...

golestan province is one of the main tobacco growing regions in the country. tobacco streak virus (tsv) is a destructive pathogen on tobacco that has a wide host range and occurs worldwide. in order to serological detection of tsv at 13 region of golestan province, 500 infected samples belong to 8 families; chenopodiacae, amaranthaceae, fabaceae, solanaceae, malvaceae, poaceae, cucurbitaceae an...