As a vital component of electronic products, the quality printed circuit board (PCB) assembly directly affects applications and service life. During reflow soldering process, PCB may suffer excessive warpage. Therefore, in order to avoid such failure, this paper conducts finite element simulation temperature change deformation process according theoretical model for heat transfer then explores ...

Viscoelastic materials for plastic encapsulated molding compounds invariably exhibit a time-dependent stress response to an imposed constant strain, which is called stress relaxation. Stress relaxation tests with molding compounds used to encapsulate microcircuits have been performed to measure the time dependent non-linear constitutive relation between stress and strain as a function of temper...

3D printing (3DP) of polymer composite products and solutions mainly relies on experimental techniques for research & development product/process/system understanding. Several studies experimentally investigated the effect infill patterns densities mechanical performance printed composites. However, due to unlimited design flexibility 3DP processes recipes, it is vital explore numerical simulat...

INTRODUCTION Woven textile structures are often used as reinforcements in composite materials. Their ease of handling, low fabrication cost, good stability, balanced properties, and excellent formability make the use of Woven Fabrics (WF) very attractive for structural applications in, for example, the automotive and aerospace industry. However, due to the process of draping the fibre orientati...

Even though recently published results indicated that residual strains of the epoxy molding compound (EMC) play a key role on the warpage values and shapes of the plastic ball grid array (PBGA) packages, it is still unknown about how these residual strains build up and change during the manufacturing and infrared (IR) solder reflow processes. The purpose of this study is to quantify the residua...

Article history: Received 25 April 2016 Received in revised form 26 June 2016 Accepted 29 July 2016 Available online 10 August 2016 The purpose of this paper is to analyze and predict the thermal deformation of the through silicon via (TSV) interposer package during themanufacturing process and to perform a parametric study to minimize thewarpage and thermal stress. Samples were selected during...

In Direct Metal Laser Sintering objects are created by sequential sintering loose metal powder particles by means of laser technology. When the laser sintering process involves temperature gradients, thermal stresses develop. Corresponding residual stresses induce warping of the densified structure leading to unacceptable tolerance losses. This paper examines the role of laser beam scan pattern...