Mardani, S. 2016. Copper and Silver Metallization for High Temperature Applications. Digital Comprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology 1406. 68 pp. Uppsala: Acta Universitatis Upsaliensis. ISBN 978-91-554-9656-2. High-temperature electricaland morphological-stability of interconnect is critical for electronic systems based on wide band gap (WBG)...

Phase equilibria in the ternary Ti-Ag-Cu system have been studied thermodynamically and experimentally at various temperatures. The thermodynamic analysis was performed by combining the most recent data on the binary Ag-Cu, Ti-Ag and Ti-Cu systems and experimental information obtained by the diffusion couple technique. The eutectic and three noneutectic binary Ag-Cu alloys were melted and annea...

Incorporation of metallic particulate reinforcements in eutectic Sn-Ag solder re­ sults in the formation of intermetallic compounds (IMCs) along particulate/ solder interfaces with different morphologies. For instance, “sunflower” and “blocky faceted” IMC shapes have been observed around Ni particle reinforce­ ments incorporated in the eutectic Sn-Ag solder matrix. The time and tempera­ ture ab...

Abstract Metal-dielectric-graphene hybrid heterostructures based on oxides Al 2 O 3 , HfO and ZrO as well complementary metal–oxide–semiconductor compatible dielectric Si N 4 covering plasmonic metals Cu Ag have been fabricated studied. We show that the characteristics of these are important for surface plasmon resonance biosensing (such minimum reflectivity, sharp phase changes, full width at ...

Ag-Cu-Ti system is important for brazing applications and mainly for ceramic joining. This system is characterized by numerous intermetallics in the Cu-Ti binary and the existence of a miscibility gap in the liquid phase. For applications, the knowledge of phase equilibria, invariant reactions in the temperature range of interest and thermodynamic activity values (mainly of Ti) are important. T...

A new embedded-atom method (EAM) potential has been constructed for Ag by fitting to experimental and first-principles data. The potential accurately reproduces the lattice parameter, cohesive energy, elastic constants, phonon frequencies, thermal expansion, lattice-defect energies, as well as energies of alternate structures of Ag. Combining this potential with an existing EAM potential for Cu...

Annealing of dilute binary Cu(Ti), Cu(In), Cu(Al), Cu(Sn), Cu(Mg), Cu(Nb), Cu(B), Cu(Co) and Cu(Ag) alloy films resulted in the strongest <111> fiber texture for Cu(Ti) and the lowest resistivity for Cu(Ag). The behavior of the alloy films was compared and contrasted with that for a pure evaporated Cu film. Electron beam evaporated films with compositions in the range of 2.0-4.2 at% and thickne...

ulations must be considered. We totally agree with his arguments. His constructive, detailed technical explanations should be tested thoroughly by the manufacturers of Ag/Cu ionization systems and taken into consideration in future experiments. Dr. Lin’s main scientific point is that the data we presented in our paper do not support the claim that Legionella developed resistance to silver. He a...

Effects of duration of exposure of single metal cations (Ag+1, Cd+2, Cu+2, Ga+3, Ni+2, and Zn+2) on 3H-thymidine (3H-Tdr) incorporation and 3-[4,5-dimethyl-thiazol-2yl-]-2,5-diphenyl tetrazolium bromide-formazan (MTT-f) production in cultured murine fibroblasts (Balb/c 3T3) were investigated, and the synergistic and antagonistic effects of two metal cations applied simultaneously to the fibrobl...

The oxy-acetylene torch brazing of copper tubes using silver-based filler metals (Ag-Cu-Zn-Cd) was investigated in this study. Filler containing silver content 15% and 35%, designated by BR15 BR35, were used to assess the influence microstructure mechanical performance brazed joints. joints analyzed means optical microscopy, scanning electron energy-dispersive spectroscopy. microstructures BR35...