We report photoacid-induced nonerasable recording in tert-butoxycarbonyl-protected quinizarin methacrylate polymers for three-dimensional optical memory. 1m/s-speed recording was achieved using an 800 nm femtosecond laser at an 80MHzrepetition rate, without a postexposure bake after laser irradiation. Three-layer recording indicates that no optical damage during recording enables modulation of ...

A general and comprehensive methodology has been developed for the characterization, modeling, and simulation of advanced technologies and complex resist materials for optical lithography. The foundation of this methodology is the new lithography simulation program, SAMPLE-ARK, which simulates reaction kinetics and diffusion, and their effect upon chemical species concentrations within the resi...

As we enter the DUV lithography generation, the developmental phase of the photolithography process is becoming crucial due to the high costs associated with the lithography equipment. Improvements in the modeling of chemically amplified resists are necessary to extract the maximum possible information from the minimum amount of experimentation. The poor man’s dissolution rate monitor (drm) met...

Submicron Deep Ultraviolet (DUV) photolithographic processes present significant manufacturing challenges due to the relatively small process windows often associated with these technologies. The sensitivity of the process to small upstream variations in incoming film reflectivity, photoresist coat and softbake steps as well as the bake plate temperature can result in the final critical dimensi...

Soldering of molded case tantalum capacitors can result in damage to Ta2O5 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture co...

This paper is companion to Y. Freeman’s and P. Lessner’s paper [1] introducing a new Flawless Technology with Simulated Breakdown Screening, (F-TECH) for manufacturing MnO2 style Tantalum (Ta) capacitors. This paper focuses on the impact that the end-user’s manufacturing processes have on reliability of Solid Ta capacitors. It demonstrates that depending on the end-user’s techniques and conditi...

We demonstrate the use of photosensitive epoxy laminate TMMF S2045 for the fabrication and sealing of tapered microfluidic channels. The 45 μm thick resist enables the fabrication of shallow sealed cavities featuring extreme aspect ratios of less than 1:40 (h = 45 μm, w = 2000 μm). It also provides high resolution and enables minimum feature sizes of 10 μm. For the fabrication of free-standing ...

In order to improve scalability and reduce maintenance overhead for structured Peer-to-Peer (P2P) systems, researchers design optimal architectures with constant degree and logarithmical diameter. The expected topologies, however, require the number of peers to be some given values determined by the average degree and the diameter. Hence, existing designs fail to address the issue due to the fa...