This work reports on a systematic investigation of the frequency comb enhancement in hybrid InAs/GaAs multisection quantum dot lasers silicon. The colliding configuration provides an operating at twice fundamental free-spectral range cold cavity. In particular, contribution linewidth factor, or αH-factor, formation is investigated with respect to reverse voltage and temperature conditions. When...

Introduction Interconnects are an important cost driver in advanced 3D chip packaging. This holds for Through Silicon Vias (TSV) for chip stacking, but also for other integrated Sitechnology. Especially in applications with a low number (<100 mm) of relatively large (10-20 μm diameter), high aspect ratio (1:5-1:20) interconnects, conventional wafer level plating processes are slow and become cu...

In current Deep Submicron (DSM) era, interconnects play important role in overall performance of the chip. The factors such as power dissipation and crosstalk through RC modeled interconnects substantially affect the entire working of the chip. Therefore, to enhance the performance, minimization or elimination of coupling between interconnects is essential. Bus-invert method is the best method ...

We design and fabricate a compact third-order coupledresonator filter on the silicon-on-insulator platform with focused application for on-chip optical interconnects. The filter shows a large flat bandwidth (3dB 3.3nm), large FSR (approximately 18nm), more than 18dB out-of-band rejection at the drop port and more than 12 dB extinction at the through port, as well as a negligible drop loss (<0.5...