Introduction: Recently, the bandpass LC current mirror has been used to increase conversion gain by combining the output differential currents at the high frequency [1, 2]. However, the passive inductors employed in the LC current mirror always occupy large chip area. In this work, the passive inductors in the LC current mirror are replaced by the active inductors consisting of the common-colle...

This paper exhibits suppression strategy of low frequency circulating current components for parallel inter-leaved converters. Here inverters are parallelized by magnetically coupled inductors. Traditionally, carrier interleaved technique was used to get lower distorted output voltage, but it gives a higher currents flow through the Two-VSC‘s. The mutual inductance inductors (CI) is utilized mi...

The paper deals with reliability evaluation procedure of thick film inductors manufactured by various techniques. Thick film inductors belong to the specific electronic passive components, which properties are known as a component „tailored“according to the application, structure and construction. Evaluation methodology principle of thick film inductors issues from entities of standardized reli...

Spiral inductors fabricated in a 0.18μm 6-level Cu interconnect low-K dielectric process suspended 100μm above the substrate with sidewall oxide removed are described. A maskless post-CMOS micromachining process has been developed for the low-K dielectric copper interconnect process. Post-CMOS process enhancements of inductors provide higher quality factors and self-resonant frequencies by unde...

We present a frequency-tunable, compact loop antenna which consists of a transmission line on a ground plane, two shorting posts, and two inductors which are serially connected between the posts and the edge of the transmission line. By properly choosing the inductance of the inductors, the operating frequency of the antenna can be controlled without seriously sacrificing fractional bandwidth. ...

There has been a tremendous research effort in recent years to move DC-DC converters on chip for enhanced performance. However, a major limiting factor to implement on-chip inductive DC-DC converters is the large area overhead induced by spiral inductors. Towards this, we propose to use through-silicon-vias (TSVs), a critical enabling technique in three-dimensional (3D) integrated systems, to i...

The advancement of CMOS technology led to the integration of more complex functions. In the particular of wireless transceivers, integrated LC tanks are becoming popular both for VCOs and integrated filters [1]. For RF applications the main challenge is still the design of integrated inductors with the maximum quality factor. For that purpose, tapered, i.e., variable width inductors have been p...

Abstract A fully soft switched high step‐up/down bidirectional converter is presented in this paper. The voltage conversion ratio achieved by a pair of coupled inductors along with capacitor while all active switches operate at zero switching. To provide switching condition for the main and absorb leakage inductance energy inductors, clamp circuits are utilized both operating modes. Furthermore...

In recent times, important contributions and the incorporation of renewable sources, such as photovoltaic, fuel cells, etc., are main reasons for popularity DC microgrids. Integrating sources into microgrid requires high-voltage, high-efficiency DC-to-DC converters. Without modification, traditional converters not suitable achieving required voltage in applications, due to requirement a large d...