Multiprocessor architectures and platforms have been introduced to extend the applicability of Moore’s law. They depend on concurrency and synchronization in both software and hardware to enhance the design productivity and system performance. These platforms will also have to incorporate highly scalable, reusable, predictable, costand energy-efficient architectures. With the rapidly approachin...

This paper shows that correlated level shifting (CLS) technique can be successfully used in the comparator based integrators with the same benefits as in the conventional integrators. With help of CLS technique the signal dependent variation reduces by making current source work in the more voltage headroom region thus an output impedance of the current source is increasing. The latter leads to...

Quantum-dot Cellular Automata (QCA) is a prominent paradigm that is considered to continue its dominance in thecomputation at deep sub-micron regime in nanotechnology. The QCA realizations of five-input Majority Voter based multilevel parity generator circuits have been introduced in recent years. However, no attention has been paid towards the QCA instantiation of the generic (n-bit) even and ...

Quantum-dot Cellular Automata (QCA) is a prominent paradigm that is considered to continue its dominance in thecomputation at deep sub-micron regime in nanotechnology. The QCA realizations of five-input Majority Voter based multilevel parity generator circuits have been introduced in recent years. However, no attention has been paid towards the QCA instantiation of the generic (n-bit) even and ...

The high aspect-ratio combined polyand single-crystal silicon micromachining technology (HARPSS) and its application to fabrication of precision MEMS inertial sensors are presented. HARPSS is a single wafer, all silicon, front-side release process which is capable of producing 10–100’s of microns thick, electrically isolated, 3-D polyand single-crystalline silicon microstructures with various s...

The performance of the manufacturing process in each of these areas determines the overall manufacturability of the process. As device geometries are reduced, understanding and minimizing the sources of process-induced defects is critical to achieving and maintaining high device yields. This paper presents comprehensive the investigating a novel metrology on semiconductor process module integra...

The use of I DDQ test as a defect reliability screen has been widely used to improve device quality. However, the increase in subthreshold leakage currents in deep sub-micron technologies has made it difficult to set an absolute pass/fail threshold. Recent work has focused on strategies that calibrate for process and/or technology-related variation effects. In this paper, a new I DDQ technique ...

Circuit design in deep sub-micron technologies requires that designers deal with numerous data, constraints, analysis, synthesis, and optimization tools. Although synthesis tools are widely used at Intel, new circuit technologies are evolving and are often not well supported by existing synthesis tools. Deep sub-micron technology requires that the impact of physical design be considered early i...