In this work, we report a method to process porous silicon to improve its chemical resistance to alkaline solution attacks based on the functionalization of the pore surface by the electrochemical reduction of 4-nitrobenzendiazonium salt. This method provides porous silicon with strong resistance to the etching solutions used in optical lithography and allows the fabrication of tailored metalli...

Controlling the thermal radiation spectra of materials is one of the promising ways to advance energy system efficiency. It is well known that the thermal radiation spectrum can be controlled through the introduction of periodic surface microstructures. Herein, a method for the large-area fabrication of periodic microstructures based on multi-step wet etching is described. The method consists o...

Recently, porous materials on the base of semiconductor crystals arouse greater interest as photon crystals in terms of opto-electronic applications and formation of arrays of nano-elements with oneand zero-dimensionality. The crystals of porous silicon have been developed best to date. The obvious trends in this field now are towards using other materials for electrolytic etching, decreasing t...

Sub-micrometre single crystal diamond membranes are of huge importance for next generation optical, quantum and electronic device applications. Electrochemical etching has proven a critical step in the production such membranes. Etching is used to selectively remove very thin layer sub-surface sp2 carbon, prepared by ion implantation bulk diamond, releasing membrane. Due nanosized dimensions, t...

The study of an innovative fluoropolymer masking layer for silicon anodization is proposed. Due to its high chemical resistance to hydrofluoric acid even under anodic bias, this thin film deposited by plasma has allowed the formation of deep porous silicon regions patterned on the silicon wafer. Unlike most of other masks, fluoropolymer removal after electrochemical etching is rapid and does no...