We report the first investigation into the potential of electroless nickel deposition to form ohmic contacts on single layer graphene. To minimize the contact resistance on graphene, a statistical model was used to improve metal purity, surface roughness, and coverage of the deposited film by controlling the nickel bath parameters (pH and temperature). The metalized graphene layers were pattern...

Electroless deposition of Au onto hydrogen-terminated Si(111) from aqueous HF solutions has been studied by Rutherford backscattering (RBS) and in situ surface second harmonic (SH) generation. The SH signal as a function of time goes through a maximum which becomes stronger and occurs at shorter times as the HF concentration is increased. This can be explained through resonant enhancement of th...

Ni-P Electroless coatings provide appropriate resistance to wear and corrosion. Co-deposition of particles between layers can improve their properties, especially general corrosion and erosion-corrosion behavior by means of nano diamond as reinforcing particles. In this study Ni-P/nano diamond composite deposition were deposited on steel substrate. Structure of the coatings and corrosion r...

The effect of an electroless Ni-Cu-P coating on the fatigue behavior of quenched and tempered CK45 steel has been investigated. The fatigue tests under rotating bending conditions have been conducted in three different conditions of uncoated, as-deposited and shot peened prior to the coating deposition. The results indicate that plating of the base steel leads to a fatigue life reduction. The d...

the effect of an electroless ni-cu-p coating on the fatigue behavior of quenched and tempered ck45 steel has been investigated. the fatigue tests under rotating bending conditions have been conducted in three different conditions of uncoated, as-deposited and shot peened prior to the coating deposition. the results indicate that plating of the base steel leads to a fatigue life reduction. the d...

As a surface finish, electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention for both packaging/IC-substrate and PWB applications. With a lower gold thickness compared to conventional electroless nickel / immersion gold (ENIG) the ENEPIG finish offers the potential for higher reliability, better performance and reduced cost.[1,2] This paper shows th...