نتایج جستجو برای: electroless plating

تعداد نتایج: 10398  

Journal: :Journal of the Surface Finishing Society of Japan 1989

Journal: :Jitsumu Hyomen Gijutsu 1988

Journal: :Journal of Japan Institute of Light Metals 2023

Hydrogen embrittlement affected by three types of plating (low-P and high-P electroless Ni-P electrolytic Zn-platin) was investigated means slow-strain-rate three-point bending test on aluminum alloys (2017-T3, 6061-T6 7075-T651). generated the zinc absorbed alloy substrates, trap sites in substrates for hydrogen differed between plating. able to be evaluated tests plated alloys. Zinc did not c...

2006
Kejun Zeng Roger Stierman Masood Murtuza

This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and the resulting interfacial structures. A focused-ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the ENIGplated pad with and without soldering. High-speed pull testing of solder joints was performed to expose the pad sur...

Journal: :Journal of nanoscience and nanotechnology 2010
Fang-Hsing Wang Tzu-Ching Lin Shien-Der Tzeng

Carbon nanotubes (CNTs) have high aspect ratio and have great potential to be applied as the field emission cathode because of its large field enhancement factor. In this work, a high performance carbon nanotube field emission cathode (CNTFC) was fabricated by using a composite plating method. The CNTs were purified by acid solutions and then dispersed in electrobath with nickel ions at tempera...

2016
Yanqing Wang Ning Li Xianliang Wang Dana Havas Deyu Li Gang Wu

In this work, we developed a new ion exchange plating (IEP) method that is different to traditional electrochemical plating or electroless plating techniques. A variety of silver patterns were prepared by using the IEP technique as demonstrated in this work. The key factors to the definition and the conductive performance of silver patterns were systematically studied. Mechanisms of the formati...

2002
Y. Zheng

This paper describes the interaction of the NEMI recommended lead-free solder for reflow assembly (Sn3.8Ag0.7Cu) with different commercial printed wiring board (PWB) platings. It also discusses the effects of plating type and manufacturer on the strength of the lead-free solder joints. PWBs from two different manufacturers with the same four types of plating were examined. The platings were org...

2002
Mark L. Weaver

An Adsorbent based treatment system is presented for toxic metal removal from rinsewater streams. The adsorbent is a Mg-A1 oxide anion exchange material with high capacity (approaching 5.5 meq/g) and strong selectivity for difficult to treat species such as Electroless plating metal chelates, Fixed Cyanides and chrome conversion solutions. Data is presented describing treatment of various metal...

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