SU-8 is an epoxy-novolac resin and a well-established negative photoresist for microfabrication and microengineering. The photopolymerized resist is an extremely highly crosslinked polymer showing outstanding chemical and physical robustness with residual surface epoxy groups amenable for chemical functionalization. In this paper we describe, for the first time, the preparation and surface modi...

The internationally growing demand for electrical energy is one of the most prominent triggers stimulating research these days. In this highly interdisciplinary research area, electrical engineers, material scientists and chemists collaborate for the design and fabrication of the next generation of high-voltage machinery and electro-technical devices. Nanocomposites with enhanced thermal conduc...

This paper reports the facile preparation, mechanical performance and linear viscoelasticity of polyetheramine-cured rubber-like epoxy asphalt composites (EACs) with different asphalt contents. Compared with previous EACs prepared via complex chemical reactions and time-consuming high-temperature curing, the EACs reported here were obtained by using a compatible, bi-functional polyetheramine an...

Adhesion is important in many industrial applications including those in the microelectronics industry. Flip-chip assemblies commonly utilize epoxy underfills to promote reliability and the buried interfacial structure of underfills is crucial to device lifetime. Poor adhesion at this interface can cause premature device failure. One method to increase adhesion strength is to plasma treat the s...

Abstract The increasing concern for environmental and economic sustainability has resulted in a growing interest recycling the hybrid structures used modern industries. To address challenge of easy separation without damaging substrates, debondable‐adhesive incorporating shape memory polymer (SMP) filler is proposed. This study synthesizes seven types epoxy SMPs at different stoichiometric rati...