Silicon wafers are used as substrates to build more than 90% of integrated circuits. One of the manufacturing processes for silicon wafers is grinding. This paper reports the investigations of silicon wafer grinding using Finite Element Analysis (FEA). FEA models are first used to study the effects of process parameters on waviness reduction in the grinding of wire-sawn wafers on a rigid chuck....

This paper presents a detailed manufacturing model that can be used for grinding a ball-end mill using 5-axis CNC (computer numerical controlled) grinding machine. The profile of the helical groove can be calculated exactly using the given wheel profile and relative movements between the workpiece and the grinding wheel. The proposed model is related to some analytical, differential geometry an...

A time-efficient surface grinding and polishing procedure was developed to remove noise pitting associated with the etching of CR-39. CR-39 is a solid-state nuclear track detector used to measure and analyze ions produced by fusion implosions on the OMEGA and OMEGA EP laser systems. Using CR-39 thickness measurements acquired during the grinding process, surface removal rates of 68 µm/min and 5...

Thermal errors and force-induced errors are two most significant sources of the NC grinding machine inaccuracy. And error compensation technique is an effective way to improve the manufacturing accuracy of the NC machine tools. Effective compensation relies on an accurate error model that can predict the errors exactly during machining. In this paper, a PSO–BP neural network modeling technique ...

In this work, grinding or microcutting tools in the form of pellets were manufactured using a bounded alumina abrasive grains. The bound used is a vitreous material containing quartz feldspars, kaolinite and a quantity of hematite. The pellets were used in glass grinding process to replace the free abrasive grains lapping process. The study of the elaborated pellets were done to define their ef...

In this study, the grindability of cast magnetic alloys (Fe-Pt-Nb magnetic alloy and magnetic stainless steel) was evaluated and compared with that of conventional dental casting alloys (Ag-Pd-Au alloy, Type 4 gold alloy, and cobalt-chromium alloy). Grindability was evaluated in terms of grinding rate (i.e., volume of metal removed per minute) and grinding ratio (i.e., volume ratio of metal rem...

Abrasive machining is a widely employed finishing process for different materials such as metals, ceramics, glass, rocks, etc to achieve close tolerances and good dimensional accuracy and surface integrity. High efficiency abrasive machining is one of the important techniques of advanced manufacture. Combined with raw and finishing machining, it can attain high material removal rate like turnin...

The actual grinding result of ceramics has not been well predicted by the present mechanical models. No allowance is made for direct effects of materials microstructure and almost all the mechanical models were obtained based on crystalline ceramics. In order to improve the mechanical models of ceramics, surface grinding experiments on crystalline ceramics and non-crystalline ceramics were cond...

Recently described scientific literature has identified the airborne presence of 2,3-butanedione (diacetyl) and 2,3-pentanedione at concentrations approaching or potentially exceeding the current American Conference of Industrial Hygienists' (ACGIH) Threshold Limit Values (TLVs) at commercial coffee roasting and production facilities. Newly established National Institutes of Occupational Safety...

Surface roughness is a significant parameter which determines the efficiency of optical components. Surface damages induced by grinding strongly influence the mechanical strength and optical quality of optical glasses. It is meaningful to rapid evaluate the surface roughness through the measurement of different grinding parameters. In this study, a cup diamond wheel (D64) is used in grinding pr...