نتایج جستجو برای: indentation depth

تعداد نتایج: 164927  

Journal: :Physical review letters 2006
C Kearney Z Zhao B J F Bruet R Radovitzky M C Boyce C Ortiz

The nanoscale anisotropic elastic-plastic behavior of single-crystal aragonite is studied using nanoindentation and tapping mode atomic force microscopy imaging. Force-depth curves coaxial to the axis exhibited load plateaus indicative of dislocation nucleation events. Plasticity on distinct slip systems was evident in residual topographic impressions where four pileup lobes were present after ...

2017
Jiangjiang Hu Yusheng Zhang Weiming Sun Taihua Zhang

At room temperature, the indentation morphologies of crystalline copper with different 13 grain size including nanocrystalline (NC), ultrafine-grained (UFG) and coarse-grained (CG) copper 14 were studied by nanoindentation at the strain rate of 0.04/s without holding time at indentation 15 depth of 2000 nm. As the grain size increasing, the height of the pile-up around the residual 16 indentati...

Journal: :Clinical biomechanics 2005
Cheryl E Dunham Sarah E Takaki James A Johnson Cynthia E Dunning

BACKGROUND The objectives of this study were to quantify the indentation strength and modulus of distal humeral cancellous bone, and to identify regional variations. The motivations were to assist in prosthesis development and to optimize screw placement. METHODS Three consecutive 3mm transverse slices were sectioned from the distal ends of seven fresh-frozen cadaveric specimens. A 3 x 3mm gr...

1999
Norman A. Fleck N. A. Fleck

The finite-element method is used to perform an accurate numerical study of the normal indentation of an elastic-plastic half-space by a rigid sphere. The effects of elasticity and strain-hardening rate of the half-space are explored, and the role of friction is assessed by analysing the limiting cases of frictionless contact and sticking friction. Indentation maps are constructed with axes of ...

Journal: :International Journal of Solids and Structures 2007

2005
P. E. Miller T. I. Suratwala L. L. Wong M. D. Feit J. A. Menapace P. J. Davis

Managing subsurface damage during the shaping process and removing subsurface damage during the polishing process is essential in the production of low damage density optical components, such as those required for use on high peak power lasers. Removal of subsurface damage, during the polishing process, requires polishing to a depth which is greater than the depth of the residual cracks present...

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