The microbeam system at the Radiological Research Accelerator Facility (RARAF) currently has a beam spot size of 0.8 microns in diameter. While this spot size is small enough to hit a targeted spot in the nucleus of a cell with a high degree of certainty, researchers at RARAF hope to accurately target even smaller components of cells in the future. This paper discusses a technique used to measu...

In this chapter a state-of-the-art review on analog integrated circuit (IC) design automation tools applied to the specification translation problem is presented. Having the right topology for a given set of specifications is indispensable for a high performance design. An inadequate topology makes the design more difficult (or even impossible), and may require unnecessary resources, which is n...

This paper presents an investigation on the processes, trends, and applications of the BiCMOS technology in the fields of microelectronics and communication electronics. The investigation will focus on the design perspectives and different modifications that were developed to provide a very-high performance BiCMOS integrated circuit for both digital and mixed-signal applications. E. A. Gonzalez...

This document describes a methodology for estimating the coupling of signals through the substrate of a mixed-signal integrated circuit. Permission to make copies, either paper or electronic, of this work for personal or classroom use is granted without fee provided that the copies are not made or distributed for profit or commercial advantage and that the copies are complete and unmodified. To...

3D integration is the big next step in system integration. It is still an emerging technology though and its implications on die and packages are not fully understood yet. Furthermore, it comes in many different process flavors. Adoption by mainstream designers requires the availability of tools that let them evaluate the cost and benefits of 3D compared to conventional system implementations. ...

The three-dimensional (3D) integrated circuit technology developed by MIT Lincoln Laboratory allows circuit structure that forms on several silicon-on-insulator (SOI) substrates to be integrated into a 3D integrated circuit. This 3D technology gives the possibility of better thermal and noise management, more compact design, and so on. However, circuit design in the 3D technology has not been f...

This paper describes a knowledge-based system for automatically synthesizing integrated circuit layouts for NMOS cells. The desired cell layouts are specified in terms of their general structural and functional characteristics. From these initial specifications, the system produces correct and CoriJpact cell layouts. The system performs this task by generating plan steps at different levels of ...

III.1. Basic Model for the Operational Amplifier. The OPerational AMPlifier (OPAMP) is a key building block in analog integrated circuit design. The OPAMP is composed by several transistors and passive elements (resistors and capacitors) and arranged such that its low frequency voltage gain is very high; the dc gain of the OPAMP-741 is around 10 V/V (10 μV at the input give us 1 V at the output...

• Small physical size: The space constraints of many detectors, most notably pixel vertex detectors, absolutely require custom microelectronics. Even when commercial electronics can be used, small ASICs can often be positioned closer to the sensor than would otherwise be possible. This reduces input capacitance and improves noise performance. In many cases the size of the cable plant is also re...