To successfully implement a packaging concept, it is imperative to resolve many challenging issues related to materials and processing, which will result in improved thermal management of the power electronics modules. Almost every parameter of a power device is a function of temperature. The heat generated by these active devices, which reduces circuit efficiency, may also degrade circuit perf...

We developed high-performance thermal interface materials (TIMs) based on a few-layer graphene (FLG) composite, where FLG was prepared by the interlayer catalytic exfoliation (ICE) method. We experimentally demonstrated the feasibility of FLG composites as TIMs by investigating their thermal and mechanical properties and reliability. We measured the thermal interface resistance (Rint) between F...

Duplex heat exchanger tubes consist oftwo concentric cylinders assembled in a state ofprestress by shrink fitting. During operation, thermal expansion changes the interface pressure and this can cause a substantial increase in the thermal resistance of the tube. Under certain circumstances, more than one steadystate solution can be obtained. In this paper, the effect of this mechanism on the ax...

Effects of matrix cracks and the attendant interface debonding and sliding on both the longitudinal and the transverse thermal diffusivities of a unidirectional Nicalon/MAS composite are investigated. The diffusivity measurements are made in situ during tensile testing using a phase-sensitive photothermal technique. The contribution to the longitudinal thermal resistance from each of the cracks...

The high mobility exhibited by both supported and suspended graphene, as well as its large in-plane thermal conductivity, has generated much excitement across a variety of applications. As exciting as these properties are, one of the principal issues inhibiting the development of graphene technologies pertains to difficulties in engineering high-quality metal contacts on graphene. As device dim...

Heat generates from power electronics must be dissipated to maintain operating temperatures within specification. Thermal management is an important design consideration in which thermal interface material (TIM) plays important role on reducing the thermal resistance between hot and cold points. AlN thin film and AlN/Al stack were used as TIM and Cu substrates was used as heat sink. The observe...

Ballistic–diffusive heat conduction, which is predominantly affected by boundaries and interfaces, will occur in nanostructures whose characteristic lengths are comparable to the phonon mean free path (MFP). Here, we demonstrated that interactions between phonons and boundaries (or interfaces) could lead to two kinds of slip boundary conditions in the ballistic– diffusive regime: boundary tempe...

With the ever-decreasing size of microelectronics, growing applications of superlattices, and development of nanotechnology, thermal resistances of interfaces are becoming increasingly central to thermal management. Although there has been much success in understanding thermal boundary resistance (TBR) at low temperature, the current models for room temperature TBR are not adequate. This work e...

In this work a thick interface model is proposed in order to describe the photothermal signal perturbation introduced by grain interfaces. The validity of the model is discussed based upon photothermal reflectance microscopy results obtained on Fe sintered samples. A comparison with the thermal resistance model, which is valid only in the case of thin interfaces, is also presented.

This work employs the self-consistent method to investigate the effective thermal conductivity distribution in functionally graded materials (FGMs) considering the Kapitza interfacial thermal resistance. A heat conduction solution is first derived for one spherical particle embedded in a graded matrix with a prefect interface. The interfacial thermal resistance of a nanoparticle is simulated by...