XRCC4-null mice have a more severe phenotype than KU80-null mice. Here, we address whether this difference in phenotype is connected to nonhomologous end-joining (NHEJ). We used intrachromosomal substrates to monitor NHEJ of two distal double-strand breaks (DSBs) targeted by I-SceI, in living cells. In xrcc4-defective XR-1 cells, a residual but significant end-joining process exists, which prim...

Here, we successfully welded two bulk metallic glass (BMG) materials, Zr51Ti5Ni10Cu25Al9 and Zr50.7Cu28Ni9Al12.3 (at. %), using a liquid-solid joining process. An atomic-scale metallurgical bonding between two BMGs can be achieved. The interface has a transition layer of ~50 μm thick. The liquid-solid joining of BMGs can shed more insights on overcoming their size limitation resulting from thei...

Abstract Obtaining a strong bond between aluminum and steel is challenging due to poor wettability melt brittle intermetallic phases forming in the interface. In this research, novel coating method, namely hot dipping of Sn, has been developed treat insert surfaces. Results show that without preheating mold or Sn-coated insert, thin, crack-free, continuous metallurgical bonding layer was achiev...

The metal-polymer hybrid system is widely used in automobile and aviation sector due to its lightweight characteristics. Besides, it has many advantages such as noise reduction damping. Inclusion of these improve the fuel economy, which eventually results dramatic carbon footprint. One important sandwich panels. These are structural members by transportation industries. Joining polymers metals ...

Three-dimensional (3D) integration is considered to be the most promising solution for the continuing improvement in device performance,[1] while the scaling of Si CMOS is approaching its economical and physical limits. Inter Chip Fill (ICF) resin, filled between the gaps of 3D stacked chips, is expected to improve the mechanical strength and corrosion resistance of such chips. Pre-applied resi...