Surface mount technology (SMT) is increasingly used in microelectronics to mount components by soldering onto the printed circuit board (PCB). The solder alloys are used as the electrical and mechanical connections between the component and the board. Fatigue failure of solder joints is recognized as a major cause of failure in electronic devices. An approach to this problem is to determine the...

S. Bulatović, Yugoslav River Shipping, Serbia, Lj. Milović, University of Belgrade, Faculty of Technology and Metallurgy, Serbia, A. Sedmak, University of Belgrade, Faculty of Mechanical Engineering, Serbia, I. Samardžić, University of Osijek, Mechanical Engineering Faculty, Slavonski Brod, Croatia Low cycle fatigue test was performed in ambient atmosphere at room temperature. Cycle loading of ...

The process of deformation and fracture structural alloys under low-cycle fatigue in conditions uniaxial loading with axial strain control complex cycle shape block has been studied. obtained results experimental studies were used to assess the possibility using nonlinear Marco - Starkey damage accumulation model. processing nickel alloy cyclic tests a simple form carried out. A combination exp...

To give a proper and accurate estimation of the fatigue life of ball grid array (BGA) solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. Experiments were conducted with 63Sn/37Pb and Sn/3.5Ag/0.75Cu solder joints in room temperature. The mechanical low cycle fatigue tests were performed under several loading angles. The loading angle is controlled by several g...

‌‌‌Fatigue behavior of a vanadium microalloy steel has been studied in this research. Here, microstructure constituents were considered which essentially are dependent on the heat treatment conditions. The results of high cycle fatigue tests revealed that heat treatment procedure and cooling rates have significant effects on fatigue properties. Optimal heat treatment cycle of the microalloyed s...

Modern electronics products move in the direction of complex, high density, high speed and also thinner and lighter for portability. Reliability of interconnection of electronics packaging has become critical issue. Major functions of electronic packaging are briefly discussed and failure mechanisms of electronic packaging are explained. Electronics packaging is subjected to mechanical vibratio...

Due to the complex geometry and thermos-mechanical loading, cylinder heads are the most challenging parts among all parts engines. They must endure cyclic thermal and mechanical loading throughout their lifetime. Cast aluminum alloys are normally quenched after solution treatment process to improve aging responses. Rapid quenching can lead to high residual stress. Residual stress is one of the ...