this paper aims to assess the application of support vector machine (svm) regression in order to analysis flexible pavements. to this end, 10000 four-layer flexible pavement sections consisted of asphalt concrete layer, granular base layer, granular subbase layer, and subgrade soil were analyzed under the effect of standard axle loading using multi-layered elastic theory and pavement critical r...

Abstract. The active development of neural network technologies and optoelectronic systems has led to the introduction computer vision in various fields science technology. Deep learning made it possible solve complex problems that a person had not been able before. use multi-spectral optical significantly expanded field application video systems. Tasks such as image recognition, object re-iden...

This paper presents a computational method for quadrilateral meshing of a thin, or narrow, two-dimensional domain for finite element analysis. The proposed method creates a well-shaped single-layered, multi-layered, or partially multi-layered quadrilateral mesh. Element sizes can be uniform or graded. A high quality, layered quadrilateral mesh is often required for finite element analysis of a ...

MOOCs have brought a revolution to education. However, their impact is mainly benefiting people with Higher Education degrees. The lack of support and personalized advice in MOOCs is causing that many of the learners that have not developed work habits and selflearning skills give them up at the first obstacle, and do not see MOOCs as an alternative for their education and training. MyLearningM...

The problem of color constancy may be solved if we can recover the physical properties of illuminants and surfaces from photosensor responses. We consider this problem within the framework of Bayesian decision theory. First, we model the relation among illuminants, surfaces, and photosensor responses. Second, we construct prior distributions that describe the probability that particular illumin...

Micro-electronic devices are increasingly incorporating miniature multi-layered integrated architectures. However, the localization of faults in three-dimensional structure remains challenging. This study involved the experimental and numerical estimation of the depth of a thermally active heating source buried in multi-layered silicon wafer architecture by using both phase information from an ...