Flip Chip Ball Grid Array (FCBGA) package has been introduced in recent years to address the needs in the microelectronic packaging industry for increasing performance and I/O density, which offers a cost effective solution with smaller form factor. Furthermore, Cu interconnects with low-k dielectric material were also introduced to reduce power consumption and further enhance device performanc...

It has been proven that polyolefins specially low density polyethylene (LDPE), are resistant against degradation and microorganism attacks; Thus, one of the most important properties of industrial plastics, is their environmental biodegradability. Since plastics are being widely used in agriculture, horticulture and packaging, meeting this requirement becomes increasingly dificult (speciall...

In this paper we discuss the automatic construction of webbased courseware applications from XML descriptions of appropriate UML models. The created applications conform to a related Learning Technology Standard for learning material interchange, namely the IMS Content Packaging standard.

A simple theoretical model was developed to assess the contribution of the pathogens and group D pharmaceutically active waste to the toxicity of the fire plume from an accidental fire in the stored material. The method was applied to stored waste at an authorised incinerator site and the study showed the additional hazard of the pathogen biohazard and pharmaceutically active material to be neg...

A perspective on abiotic material encapsulation inside virus capsids is provided. The emphasis is on the physical principles of virus assembly relevant to packaging, strategies for encapsulation and capsid modification, and on emerging applications.