A review of recent progress in hybrid integrated platforms for silicon photonics is presented. Integration of III-V semiconductors onto silicon-on-insulator substrates based on two different bonding techniques is compared, one comprising only inorganic materials, the other technique using an organic bonding agent. Issues such as bonding process and mechanism, bonding strength, uniformity, wafer...

Here we report an approach to roll out Li-ion battery components from silicon chips by a continuous and repeatable etch-infiltrate-peel cycle. Vertically aligned silicon nanowires etched from recycled silicon wafers are captured in a polymer matrix that operates as Li(+) gel-electrolyte and electrode separator and peeled off to make multiple battery devices out of a single wafer. Porous, electr...

A phenomenon resembling natural ball lightning can be produced via electrical arcing through silicon. We use lump silicon instead of silicon wafers to achieve higher production rates and larger, longer-lived luminous balls than previously reported. The luminous balls consist of a silicon core surrounded by a porous network of loosely bound silicon dioxide nanoparticles. We find that the balls c...

The chemical composition and texture of titanium coatings can influence the growth characteristics of the adhered cells. An enhanced proliferation of the human mesenchymal stem cells (hMSCs) would be beneficial. The present study was aimed to investigate whether titanium deposited at different atmospheres would affect the cell growth properties, cellular morphology, and expression of surface ma...

Ž . Y High sensitivity acoustic transducers microphones have been fabricated on 5 wafers in a production environment and the experimental results are presented. One of the main advantage of this microphone design is that it can be fabricated on a single wafer Ž eliminating the need for the multiple wafers and subsequent wafers bonding steps as in conventional designs. The devices use thin ;3 . ...

We provide a smooth introduction to reduced-rank analysis via singular-value decomposition, and show how it can be used to monitor images of etched silicon wafers. An industrial case study is discussed.

Silicon nanowires (SiNWs) are electrochemically porosified to generate mesopores in sizes of 2-50 nm, resulting in the creation of mesoporous silicon nanowires (mpSiNWs). The porosification imposes two characteristics on to SiNWs: an increase of surface areas in the porous profile and quantum confinement ascribed to the shrinkage of silicon skeletons. Since the first report on producing mpSiNWs...