The high surface areas of nanostructured electrodes can provide for significantly enhanced surface loadings of electroactive materials. The fabrication and characterization of nanoporous gold (np-Au) substrates as electrodes for bioelectrochemical applications is described. Robust np-Au electrodes were prepared by sputtering a gold-silver alloy onto a glass support and subsequent dealloying of ...

Sn-3.0Ag-0.5Cu (SAC305) alloy is the most widely used solder in electronic assemblies. However, issues associated with cost and drop/shock durability have resulted in a continued search for alternative solder alloys. One approach to improve the drop/shock reliability has been to reduce the silver content in Sn-AgCu alloys. Another approach is doping Sn-Ag-Cu solder with additional elements. Mor...

early a million years ago, mankind’s technological march through time beN gan after fire was mastered. Metalworking, which evolved into metallurgy, is the oldest and most successful technology. It spans at least 12,000 years (Figure 1). Soldering, a key metal joining technology, was probably developed about 7,000 years ago when lower melting, naturally occurring metal alloys were placed in the ...

We report on a novel fabrication approach of metal nanowires with complex surface. Taking advantage of nodular growth triggered by the presence of surface defects created intentionally on the substrate as well as the high tilt angle between the magnetron source axis and the normal to the substrate, metal nanowires containing hillocks emerging out of the surface can be created. The approach is d...

Lactobacillus strains, common in buttermilk, assist the growth of gold, silver, and gold-silver alloy crystals of submicron dimensions upon exposure to the precursor ions. Several well-defined crystal morphologies are observed. Crystal growth occurs by the coalescence of clusters, and tens of crystals are found within the bacterial contour. Crystal growth does not affect the viability of the ba...

Electronic Polymers are solving new problems in the technology revolution brought on by the quest for ultimate computing performance. Computing power will increase by an order of magnitude during this decade and MultiChip Modules (MCM) will be the main enabling technology. The MCM strategy of closely packing bare die onto inorganic or polymer substrates demands new materials, especially for die...

Density functional study of the experimentally observed ligand-protected gold alloy clusters reveal the same stabilization mechanism as in ligand protected pure AuN: the delocalized s-electron subsystem of a high symmetry metal core exhibits a shell closing. On the basis of this observation it is predicted that the substitution of a single Au atom in the well-known Au25(SR)18 compound with Pd, ...

ABSTRACT The activity coefficient of oxygen [Formula: see text] in liquid Ag and binary Ag-Te dilute alloys were determined between 1,285 and 1,485 K by coulometric titration using the electrochemical cell (Ir, [O] in liquid metal or alloy | yttria stabilized zirconia | air, Pt). The experimental and evaluation procedures described in the literature were adopted. The oxygen activity coefficient...

This study investigated the machinability of experimental Ti-Ag alloys (5, 10, 20, and 30 mass% Ag) as a new dental titanium alloy candidate for CAD/CAM use. The alloys were slotted with a vertical milling machine and carbide square end mills under two cutting conditions. Machinability was evaluated through cutting force using a three-component force transducer fixed on the table of the milling...