Low-dimensional semiconductors are considered promising candidates for thermoelectric applications with enhanced performance because of a drastic reduction in their thermal conductivity, κl, and possibilities of enhanced power factors. This is also the case for traditionally poor thermoelectric materials such as silicon. This work presents atomistic simulations for the electronic, thermal, and ...

The development of new routes for the production of thermoelectric materials with low-cost and high-performance characteristics has been one of the long-term strategies for saving and harvesting thermal energy. Herein, we report a new approach for improving thermoelectric properties by employing the intrinsically low thermal conductivity of a quasi-one-dimensional (quasi-1D) crystal structure a...

The present paper discusses the development of a performance model of power generation system of a thermal plant for performance evaluation using Markov technique and probabilistic approach. The study covers two areas: development of a predictive model and evaluation of performance with the help of developed model. The present system of thermal plant under study consists of four subsystems with...

This paper provides an overview of the thermal and power challenges in emerging high performance computing platforms. The advent of new sophisticated applications in highly diverse areas such as health, education, finance, entertainment etc. is driving the platform and device requirements for future systems. The key ingredients of future platforms are vertically integrated (3D) die-stacked devi...

In this paper, three-dimensional incompressible laminar fluid flow in a rectangular microchannel heat sink (MCHS) using Al2O3/water nanofluid as a cooling fluid is numerically studied. CFD prediction of fluid flow and forced convection heat transfer properties of nanofluid using single-phase and two-phase model (Eulerian-Eulerian approach) are compared. Hydraulic and thermal performance of microch...

The thermal diffusion factor, aT, for a binary gas mixture is calculated on the basis of nonequilibrium thermodynamics. A new formula for aT is derived and this factor is given for several paris of gases according to this formula.

Most of the conventional thermal management techniques can be used to cool the whole chip. Since thermal design requirements are mostly driven by the peak temperatures, reducing or eliminating hot spots could alleviate the design requirements for the whole package. Monolithic solid-state microcoolers offer an attractive way to eliminate hot spots. In this paper, we review theoretical and experi...

The present work demonstrates the fabrication methodology of a three-dimensional (3-D), aluminum wire filament, bonded mesh deployed as a heat exchange surface. A model of the effective thermal conductivity of the mesh is developed. Apparatus to measure the coolant pressure-drop and heat transfer coefficient are described. Measurements are reported for fabricated test samples of varying thickne...

This paper presents the experimental investigations conducted on a vertical closed loop pulsating heat pipe (VCLPHP) to evaluate the thermal performance. The values of thermal resistance and heat transfer coefficient obtained in the experimentation is used as evaluation parameters. The VCLPHP used has capillary tubes having an inner diameter of 2mm and outside diameter 3mm and bent into 5 turns...

Multimodal remote sensing approach is based on merging different data in different portions of electromagnetic radiation that improves the accuracy in satellite image processing and interpretations. Remote Sensing Visible and thermal infrared bands independently contain valuable spatial and spectral information. Visible bands make enough information spatially and thermal makes more different ra...