نتایج جستجو برای: thermal requirement

تعداد نتایج: 382216  

Journal: :IBM Journal of Research and Development 2005
Roger R. Schmidt E. E. Cruz Madhusudan K. Iyengar

The need for more performance from computer equipment in data centers has driven the power consumed to levels that are straining thermal management in the centers. When the computer industry switched from bipolar to CMOS transistors in the early 1990s, low-power CMOS technology was expected to resolve all problems associated with power and heat. However, equipment power consumption with CMOS ha...

2008
Jeffrey R. Piepmeier

The problem of RFI in spaceborne microwave radiometer data has been known since 1978 when it was first observed at 6.6 GHz with SMMR on SeaSat. Over the last several years, however, it has started to seriously impact remote sensing science products and is expected to continue to do so. This is primarily because the frequency requirements of remote sensing have begun to overlap active radio serv...

2010
C. RANDALL LEWIS RICHARD E. EDWARDS MICHAEL A. SANTORO

The 3M Company incinerates chemical wastes from manufacturing operations in a 23 M kcal/hr (90 MM Btu/hr) rotary kiln incinerator which has air pollution control equipment. This paper deals with the essential features which have resulted in this successful incineration operation for industrial wastes. These features include waste materials handling considerations, design aspects, and main­ tena...

2014
Carlos Giraldo Jens Klump Matthew Clarke Judith M. Schicks

Naturally occurring gas hydrates are regarded as an important future source of energy and considerable efforts are currently being invested to develop methods for an economically viable recovery of this resource. The recovery of natural gas from gas hydrate deposits has been studied by a number of researchers. Depressurization of the reservoir is seen as a favorable method because of its relati...

Journal: :ERCIM News 2008
Andreas Gerstinger Heinz Kantz Christoph Scherrer

49 All these systems have an important common feature: they are safety-critical and must therefore be developed according to the highest safety integrity level (SIL4), as defined in the standards applicable to the railway industry (CENELEC 50126, 50128, 50129, Railway Applications Standards [RAMS, software and electronics]). Apart from being suitable for safety-critical operation, railway syste...

2009
Robert Green

Power Consumption and Competitive Advantage Minimizing power consumption is one of the most critical design goals for portable wireless devices. Heat dissipation due to undesirable power requirements affects product reliability and product life. Most important, and one of the few things the average consumer understands, is the useable time of the device between battery charges. Longer operating...

2009
Albert Tarancón

Lowering the operating temperature of solid oxide fuel cells (SOFCs) to the intermediate range (500–700 oC) has become one of the main SOFC research goals. High operating temperatures put numerous requirements on materials selection and on secondary units, limiting the commercial development of SOFCs. The present review first focuses on the main effects of reducing the operating temperature in ...

2012
Dragica Kostic Perovic

For many, in wheel motors offer a panacea for vehicle design. However, history shows the delivery of an acceptable in wheel motor is a deeply challenging task which is dedicated to understanding aggressive torque and speed requirements behind demands on vehicle performance such as high speeds or sustained hill climb, and even aggressive driving, all of which are allowed by delivery of high cont...

Journal: :Microelectronics Journal 2008
Younès Ezzahri G. Zeng K. Fukutani Zhixi Bian Ali Shakouri

Most of the conventional thermal management techniques can be used to cool the whole chip. Since thermal design requirements are mostly driven by the peak temperatures, reducing or eliminating hot spots could alleviate the design requirements for the whole package. Monolithic solid-state microcoolers offer an attractive way to eliminate hot spots. In this paper, we review theoretical and experi...

1998
B. M. ROMENESKO Matthew G. Bevan Bruce M. Romenesko

A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...

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