نتایج جستجو برای: thermal resistance measurement
تعداد نتایج: 1003814 فیلتر نتایج به سال:
in this study, thermal performance of a cylindrical heat pipe is investigated numerically. three different types of water based nanofluids, namely (al2o3+water), (diamond+water) and (multi-wall carbon nano tube (mwcnt) +water) have been used. the influence of using the simple nanofluids and mwcnt nanofluid on the heat pipe characteristics such as liquid velocity, pressure profile, temperature p...
Being brittle and having low thermal conductivity, refractories suffer damage and sometimes fail in service as a result of thermal shock. While the approach of those making fine-grained technical ceramics is to make their products sufficiently strong to withstand thermal stresses the refractory technologist is more cunning. He uses, often little known, devices to provide resistance to thermal s...
University of Newcastle upon Tyne, Newcastle upon Tyne, NE1 7RU, England; Now, University of Michigan, Ann Arbor, MI 48109 The work vf Jaeger [l] and Barber [2] indicates that the division of frictional heat between sliding solids should be sensitive to the interfacial boundary conditions. Thus it should provide a guide to the nature of asperity interactions and a more accurate statement of the...
In this paper, the temperature dependent electrical measurements by employing a Quantum Focus Instrument (QFI) and analytical analysis were presented and applied to Aluminum Gallium Nitride, Gallium Nitride (AlGaN-GaN) High Electron-Mobility Transistors (HEMTs). The analytical evaluation of band bap energy, electron mobility, thermal conductivity and thermal resistance has been carried out. The...
High heating current dependence of the IGBT module junction-case steady state thermal resistance is investigated. The conception of the thermal resistance and the physical structure of the IGBT module and the thermal impedance test principle are briefly introduced. The junction-case thermal resistance can be deduced by Finite Element Method in the numerical simulator ANSYS. The transient therma...
Thermal resistance is a key technical index which indicates the thermal management of multi-chip module high power LED (MCM-LED) packaging heat dissipation system. In this paper, the prototype structure of MCM-LED packaging heat dissipation system is proposed to study the reliable thermal resistance calculation method. In order to analyze the total thermal resistance of the MCM-LED packaging he...
BACKGROUND The ability to withstand thermal stress is considered to be of crucial importance for individual fitness and species' survival. Thus, organisms need to employ effective mechanisms to ensure survival under stressful thermal conditions, among which phenotypic plasticity is considered a particularly quick and effective one. METHODOLOGY/PRINCIPAL FINDINGS In a series of experiments we ...
Solder connections provide an electrical and mechanical connection between components PCB (Printed Circuit Board) in electronic devices. It is very important to develop a reliable method detect the cracks quality control field of solder joints. When crack generated joint, parts are replaced by air gaps, leading increase thermal resistance heat transfer path. As result, detection changes could g...
Measurement of Interfacial Thermal Resistance by Periodic Heating and a Thermo-Reflectance Technique
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