In this study, it was attempted to design a high-performance single-walled carbon nanotube (SWCNT) bundle interconnects in a full adder. For this purpose, the circuit performance was investigated using simulation in HSPICE software and considering the technology of 32-nm. Next, the effects of geometric parameters including the diameter of a nanotube, distance between nanotubes in a bundle, and ...

This chapter discusses about the behavior of Carbon Nanotube (CNT) different structures which can be used as interconnect in Very Large Scale (VLSI) circuits in nanoscale regime. Also interconnect challenges in VLSI circuits which lead to use CNT as interconnect instead of Cu, is reviewed. CNTs are classified into three main types including Single-walled Carbon Nanotube (SWCNT), CNT Bundle, and...

Based on the transmission line model (TLM), we present an exact and general transfer function formula, useful for both single multiwall carbon nanotube (MWCNT) and MWCNT bundle interconnects. Using the standard parameters for 22-nm technology node we perform the Nyquist stability analysis, to investigate the dependence of the degree of relative stability for both single and bundle interconnects...

The aroused quest to reduce the delay at interconnect level is main urge of this paper, so as come across a configuration carbon nanotube (CNT) bundles, namely, squarely packed bundles mixed CNTs. demonstrated approach in paper makes CNT bundle adaptable adopt for high-speed very-large-scale integration (VLSI) interconnects with technology shrinkage. To proposed bundle, behavioral change resist...

In this work, we have studied Joule heating in carbon nanotube based very large scale integration (VLSI) interconnects and incorporated Joule heating influenced scattering in our previously developed current transport model. The theoretical model explains breakdown in carbon nanotube resistance which limits the current density. We have also studied scattering parameters of carbon nanotube (CNT)...