Low-dimensional cuprous nitride (Cu3N) was synthesized by nitridation (ammonolysis) of cuprous oxide (Cu2O) nanocrystals using either ammonia (NH3) or urea (H2NCONH2) as the nitrogen source. The resulting nanocrystalline Cu3N spontaneously decomposes to nanocrystalline CuO in the presence of both water and oxygen from air at room temperature. Ammonia was produced in 60% chemical yield during Cu...

The influence of nitrogen excess on the optical response of N-rich Cu3N films is reported. The optical spectra measured in the wavelength range from 0.30 to 20.00μm have been correlated with the elemental film composition which can be adjusted in the nitrogen atomic percentage (at%) range from 27 ± 2 up to 33 ± 2. The absorption spectra for the N-rich films are consistent with direct optical tr...

Copper oxide nanoparticles within hollow mesoporous silica spheres were prepared by binding/adsorbing Cu2+ or [Cu(NH3)4(H2O)2]2+ ions on the surface of carbon spheres, followed by formation of a mesoporous silica shell by sol-gel processing and calcination in air. The CuO nanoparticles can subsequently be converted into Cu3N nanoparticles by nitridation with ammonia. The effect of the different...

PVD-deposited Cu3N has been demonstrated for Cu-Cu bonding as a low-cost passivation material. exhibits stability at room temperature but undergoes decomposition upon heating, making it an attractive candidate Cu passivation. XRD analysis reveals that the of primarily occurs within range 200250. Cu3N-Cu3N bonding, relying on reaction, is successfully demonstrated, and TEM confirms presence grai...

Herein we describe an alternative strategy to achieve the preparation of nanoscale Cu3N. Copper(II) oxide/hydroxide nanopowder precursors were successfully fabricated by solution methods. Ammonolysis oxidic can be achieved essentially pseudomorphically produce either unsupported or supported nanoparticles nitride. Hence, Cu3N particles with diverse morphologies synthesized from oxygen-containin...

CuO, as a promising photocathode material, suffers from severe photocorrosion in photoelectrochemical water splitting applications. Herein, Cu3N protection shell was used to protect the CuO for first time effectively suppress of CuO. Consequently, Cu3N-protected shows improved stability, retaining 80% its initial current density 20-min test, while only 10% can be retained bare photocathode. Thi...

Copper nitride (Cu3N) has gained significant attention recently due to its potential in several scientific and technological applications. This study focuses on using Cu3N as a solar absorber photovoltaic technology. thin films were deposited glass substrates silicon wafers via radio-frequency magnetron sputtering at different nitrogen flow ratios with total pressures ranging from 1.0 5.0 Pa. T...

Cu3N with a cubic crystal structure is obtained in this paper by the sputtering of Cu under N2 followed annealing NH3: H2 at 400 °C, after which it was doped iodine room temperature resulting into p-type hole densities between 1016 and 1017 cm−3. The exhibited distinct maxima differential transmission ~2.01 eV 1.87 as shown ultrafast pump-probe spectroscopy, corresponding to M R direct energy b...

Thin and continuous copper films serve as seed layers for electrodeposition of interconnects in microelectronic devices. Gaps in the continuity of these Cu films must be avoided, because they can generate voids that later lead to failure of the devices. It is difficult to sputter completely continuous copper-seed layers into the increasingly narrow trenches and holes in modern interconnects. He...

Cu seed layers for future interconnects must have conformal step coverage, smooth surface morphology, and strong adhesion. Conformal deposition had been achieved by chemical vapor deposition CVD , but CVD Cu films have rough surfaces and poor adhesion. In this paper, conformal, smooth, adherent, continuous, and thin 9 nm Cu films were made by CVD. CuON was deposited from a Cu-amidinate precurso...