the effect of an electroless ni-cu-p coating on the fatigue behavior of quenched and tempered ck45 steel has been investigated. the fatigue tests under rotating bending conditions have been conducted in three different conditions of uncoated, as-deposited and shot peened prior to the coating deposition. the results indicate that plating of the base steel leads to a fatigue life reduction. the d...

in this research a layer of ni-cu-p was deposited on 304 stainless steels by using gelatin and thiourea asadditives in a sulfate solution. in order to determine the properties of deposited layers, a microhardness testerwas used for microhardness measurement, x.r.d. for microstructural analysis, and a scanning electronmicroscope equipped with e.d.x. for determining morphology and analyzing the d...

The ternary Ni–P–W alloy coating was fabricated by RF magnetron sputtering technique with dual targets of Ni–P/Cu and pure W. Electroplating Ni–P process was introduced to obtain the NiP compound target with extra-high phosphorous contents around 21 at.%. The deposition rate achieved as high as 20 Am/h after modification of the processing parameters. The Ni–P–W coating with a high P/Ni ratio of...

The growth kinetics of intermetallic compound layers formed between eutectic Sn–58Bi solder and (Cu, electroless Ni–P/Cu) substrate were investigated at temperature between 70 and 120◦C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P system satisfied the parabolic law at given temperature range. As a whole, because the va...

t is well recognized that electroless I.' nickel-phosphorus offers excellent deposition characteristics, such as uniform coverage, freedom from porosity, hardness, corrosion resistance, solderability, braze and weldability, wear resistance and lubricity.' Interest in the properties of electroless nickel has grown in recent years, leading to the development of wide-ranging applications, a compre...

In this study, UBM material systems for flip chip solder bumps on Cu pads were investigated using the electroless copper (E-Cu) and electroless nickel (E-Ni) plating methods; and the effects of the interfacial reaction between UBMs and Sn–36Pb–2Ag solders on the solder bump joint reliability were also investigated to optimize UBM materials for flip chip on Cu pads. For the E-Cu UBM, scallop-lik...

Lead-free soldering for electronic industry is a segment of global trend toward lead-free environment. Although initiated in U.S. in early 1990’s, it advanced much more rapidly in Japan and Europe. This differentiation in Pb-free progress triggered great concerns of users of Pb-containing solders about maintaining business opportunity, therefore further expedites the advancement of Pb-free sold...

A novel technique for obtaining nonanomalous Ni-Zn-P coatings with high Ni content ~74 wt % as compared to 15-20 wt % in the conventional plating method! has been developed. These coatings show promise as a replacement for Cd in sacrificially protecting steel. Ni-Zn-P coatings were deposited using an electroless method from a solution containing NiSO4 , complexing agent and ammonium chloride. V...

Among various lead-free alloys, Sn-Ag(-Cu) system solders are considered the most promising lead-free solders for both wave and reflow soldering technology. Moreover, to improve the characteristics of lead-free solders, the effect of the addition of minor elements to lead-free solders on the properties of solder and interfacial reactions have been studied. The purpose of this research was to in...