in this research a layer of ni-cu-p was deposited on 304 stainless steels by using gelatin and thiourea asadditives in a sulfate solution. in order to determine the properties of deposited layers, a microhardness testerwas used for microhardness measurement, x.r.d. for microstructural analysis, and a scanning electronmicroscope equipped with e.d.x. for determining morphology and analyzing the d...

The influence of pretreatment of AAO template and deposition process on magnetic NiCoFe nanowire fabricated by electroless method was investigated. The Electroless process carried out at room temperature using DMAB as a reductant agent. SEM and EDX analysis used to characterize the deposited sample. According to the results, sonication during deposition process is not recommended in fabrication...

The paper discusses optimising work on a method of processing ceramic / metal composite coatings for various applications and is based on preliminary work on processing anodes for solid oxide fuel cells (SOFCs). The composite coating is manufactured by the electroless co-deposition of nickel and yttria stabilised zirconia (YSZ) simultaneously on to a ceramic substrate. The effect on coating cha...

despite having some useful properties, stainless steels suffer from lack of suitable surface hardness. in this research electroless ni-b-tl coating was used with the aim to increase their surface hardness. the effects of nickel chloride, sodium borohydride, thallium nitrate and ethylendiamin on the chemical composition of coating were studied. to achieve an increase in hardness, the effects of ...

The formation of Au microbump arrays for flip-chip bonding was investigated using an electroless Au plating bath. Generally, electroless Au deposition gives a low deposition rate, preventing the fabrication of Au bumps with heights of more than 5 μm. To overcome this problem, we developed a new electroless Au deposition process that employs a non-cyanide bath. This process delivers a high depos...

ELECTROLESS DEPOSITION OF SUPERCONDUCTING MAGNESIUM DIBORIDETHIN FILMS ON VARIOUS SUBSTRATES

For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto the surface of the AI bondpads of the die is the first step in the wafer bumping process. The UBM is necessary, as the fragile AI pad has a tenacious oxide layer that cannot be soldered without the use of strong fluxes and a barrier layer is required to prevent dissolution of the bondpad into the...

We have employed electroless deposition to prepare smooth films (mirrors) of silver that could be used as substrates in microcontact printing (μCP) of alkanethiols. Good-quality SAMs of hexadecanethiolate were formed on thin films of electroless silver by printing with an elastomeric stamp; these SAMs were effective resists in protecting the underlying silver from etching in an aqueous ferricya...

The electroless coating technique is one of the elegant methods available for the production of protective coatings on surface. Our study has been aimed at the conditions of the electroless deposition of copper coating onto the iron powder particles from sulphate electrolyte. The course of the electroless process depends on the composition and pH of the electrolyte as well as on the size and co...

Very often electroless electrolytes contribute to wastewater treatment problems. These electrolytes are used in electroless plating processes, which contain a variety of chemicals to meet special surface treatment requirements. Metal salts produce the base material for metal deposition and hypophosphite is delivering the electrons for the metal reduction process – it is basically the internal e...