A comparing study on formation and microstructure features of aluminum titanate is investigated through both solid-state and sol-gel processes. Aluminum titanate formed by firing at 1350ºC and 1450ºC for 4h in solid-state process. In the sol-gel process formation of submicron sized particles is followed by addition of sucrose into the transparent sol. XRD analysis was confirmed the formation of...

Continuous solidification experiments were carried out with Cu-Bi-Sn alloys under the effects of Electric Current Pulses (ECPs). A model describing the microstructure evolution was developed. The formation of the microstructure in the continuously solidified alloys was calculated. The calculations demonstrated that ECPs mainly affect the solidification process through changing the energy barrie...

A newly developed microstructure‐sensitive extreme value probabilistic framework for fatigue variability based on computational polycrystal plasticity is exercised to compare the driving forces for fatigue crack formation (nucleation and early growth) at room temperature for four different microstructure variants of duplex a Ti‐6Al‐4V alloy. The aforementioned probabilistic framew...

The formation resistivity factor evaluation of brine-filled reservoir rock is an essential part of electrical resistivity log interpretation in petroleum exploration. Empirical relations such as Archie’s law are widely employed to model the relationship between the formation resistivity factor and porosity. Historically, the Archie cementation exponent has been obtained from experimental labora...

Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods a...

An oscillatory microstructure has been observed during deep-cellular growth of directionally solidified Sn-36at.%Ni hyperperitectic alloy containing intermetallic compounds with narrow solubility range. This oscillatory microstructure with a dimension of tens of micrometers has been observed for the first time. The morphology of this wave-like oscillatory structure is similar to secondary dendr...