purpose: the distinction between the concepts of science and technology has made it necessary for economic and scientific policymakers to know the realms of these two areas. the relationship between the science and the technology is changing and also is variable depending on the circumstances, scientific areas, and from one time to another one. the current research aims at studying the growth t...

Due to the continuous progress in nano-scale technology highly complex systems can nowadays be integrated into a single chip or package, and emerging approaches for the 3D-integration of densely coupled chip-stacks provide the basis for manifold new applications. Meanwhile, systems-in-a-package (SiP) and networks-on-a-chip (NoC) constitute the core components of many applications ranging from c...

Besides its interesting physical properties, graphene as a two-dimensional lattice of carbon atoms promises to realize devices with exceptional electronic properties, where freely suspended graphene without contact to any substrate is the ultimate, truly two-dimensional system. The practical realization of nano-devices from suspended graphene, however, relies heavily on finding a structuring me...

In this paper, we study the effect of single Boron/Nitrogen impurityatom on electronic properties of a silicene nano flake. Our calculations are basedon density functional theory by using Gaussian package. Here, one Si atom insilicene nano flake substitutes with a Boron/Nitrogen atom. The results show thatsubstitution of one Si atom with single Boron/Nitrogen atom increases distanceof impurity ...

The miniaturization of nano-scale electronic devices, such as metal oxide semiconductor field effect transistors (MOSFETs), has given rise to a pressing demand in the new theoretical understanding and practical tactic for dealing with quantum mechanical effects in integrated circuits. Modeling and simulation of this class of problems have emerged as an important topic in applied and computation...

Recently, nano-composite solders have been developed in the electronic packaging materials industry to improve the creep and thermo-mechanical fatigue resistance of solder joints to be used in service at high temperatures and under thermo-mechanical fatigue conditions. This paper reviews the driving force for the development of nano-composite solders in the electronic packaging industry and the...