tepe sagzabad, a site situated on the qazvin plain of north-central iran, was excavated from 1970 to 1998 by the institute ofarchaeology of tehran university. recent excavations by h. tala’i (1997-1999) yielded some metal artifacts dating to theearly iron age. ten of these copper-based samples were investigated using inductively coupled plasma optical emissionspectroscopy (icp-oes), scanning el...

Tepe Sagzabad, a site situated on the Qazvin Plain of north-central Iran, was excavated from 1970 to 1998 by the Institute ofArchaeology of Tehran University. Recent excavations by H. Tala’i (1997-1999) yielded some metal artifacts dating to theEarly Iron Age. Ten of these copper-based samples were investigated using inductively coupled plasma optical emissionspectroscopy (ICP-OES), scanning el...

in the present research, friction stir welding (fsw) process was used for butt joining of pure copper plate to 316l stainless steel plate. mechanical properties and microstructural characteristics of the joint were evaluated by microhardness and tensile tests as well as optical and scanning electron microscope (sem). it was found that microstructure of the weld nugget (wn) has fine grains where...

nowadays, equal channel angular pressing, known as the ecap process, is one of the most popular methods for manufacturing ultra-fine grained (ufg) materials. in this paper, ecap process has been carried out on pure copper and 6012 aluminum alloy up to six passes by route . principal attention was paid to the influence of parameters such as diameter, material, and the height of billet on mechani...

This paper [1] has been retracted as it is essentially identical in content with the published article " Elucidating of rotation speed in friction stir welding of pure copper: Thermal modeling " published in References [1] M. Jabbari and C. C. Tutum, " Optimum rotation speed for the friction stir welding of pure copper, "

in this article, commercially pure copper samples were severely deformed by equal channel angular pressing (ecap) up to eight passes at room temperature. the effects of severe plastic deformation on the microstructure, mechanical properties, and electrical conductivity of the copper were investigated. the microstructure evolution was followed by optical microscope and field emission scanning el...

The amount of twin formation of electroplated and thermally treated copper thin films was evaluated by electron back-scattering diffraction (EBSD) analysis. The result establishes the importance of twin formation in the analysis of stress-induced voiding, and indicates that with the inclusion of a copper alloy co-element, twin formation was significantly reduced relative to pure-copper. Further...