In the electronics manufacturing industry, soldering plays a key role in the process, whether it is carried out manually, semi-automatically or fully automatically. Even though the basic techniques in manual soldering are comparatively straightforward, to master it at a high level still requires a lot of time and effort. The research presented in this paper aims to identify the motor skills inv...

Over recent years the electronics manufacturing industry has seen a shift away from wave soldering towards reflow soldering [1]. However, although wave soldering is indeed mature (first used during the 1950’s [eg 2]), there is still significant activity with novel process development to match [3]. This paper concerns a new type of noclean liquid flux for wave soldering that is based on water [4...

Today’s wave soldering processes solder electronic assemblies within the large eutectic tin lead processing window. The issues surrounding the conversion to lead free assembly are multiple and varied. Logistics, cost, material selection, and equipment choices/options are some of these challenges that require planning and organization. However, at the core of lead free assembly is soldering. The...

What automated soldering methods can be considered for Mini-Circuits surface-mount components? There are two basic methods: reflow and wave soldering. Generally, reflow soldering can be done when (l) there are only surface mount components, or (2) these are present together with through-hole components and the latter will be soldered in a separate (wave soldering) step. The surface-mount compon...

In the study, embedded BASIC Stamp 2 (BS2) microchip controller is used to design with Hopfield neural network (HNN) as the foundation of sample training, which applies for a soldering platform of mechanical vision and accomplishes PCB soldering positioning technology. The proposed system design method in this paper can be divided into two parts: 1) the control rules of RC servo motor is design...

PURPOSE The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. MATERIALS AND METHODS Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method ...

We start this work by revisiting the problem of the soldering of two chiral Schwinger models of opposite chiralities. We verify that, in contrast with what one can conclude from the soldering literature, the usual sum of these models is, in fact, gauge invariant and corresponds to a composite model, where the component models are the vector and axial Schwinger models. As a consequence, we reint...

Introduction Parts of a bridge are related either clinically by the dentist, the direct index, or by the technician in the laboratory, the indirect index, to assemble the parts and invest them for soldering. T o form a direct occlusal index the dentist seats the bridge parts on the teeth and usually either makes a plaster impression record' or uses a self-curing acrylic resin record from which ...