نتایج جستجو برای: bonding

تعداد نتایج: 43811  

2011
Vincent Richefeu Farhang Radjai

We present here the capillary cohesion resulting from a liquid bridge between two particles. The bridge between two particles of different sizes takes a complex shape as illustrated in figure 1. R1 and R2 are the particle radii, ζ1 and ζ2 are the filling angles (corresponding to the wetted surface of the particles), θ is the wetting angle, and δn is the distance between particles. The axis x co...

Journal: :American journal of orthodontics and dentofacial orthopedics : official publication of the American Association of Orthodontists, its constituent societies, and the American Board of Orthodontics 1999
B C Koo C H Chung R L Vanarsdall

An in vitro study was conducted to evaluate the accuracy of bracket placement for direct and indirect bonding techniques. Nineteen sets of duplicated Class II malocclusion models were divided into three groups: (1) one set for ideal bracket placement, (2) nine sets for direct bonding on mannequins, and (3) nine sets for indirect bonding. Both direct and indirect bonding were performed on all te...

2015
Kozo Anno Mao Shibata Toshiharu Ninomiya Rie Iwaki Hiroshi Kawata Ryoko Sawamoto Chiharu Kubo Yutaka Kiyohara Nobuyuki Sudo Masako Hosoi

BACKGROUND Previous research has suggested that extraordinary adverse experiences during childhood, such as abuse, are possible risk factors for the development of chronic pain. However, the relationship between the perceived parental bonding style during childhood and chronic pain has been much less studied. METHODS In this cross-sectional study, 760 community-dwelling Japanese adults were a...

Background and Aim: This study aimed to evaluate the effect of repeated bonding by self-etching primers (SEPs) and a conventional phosphoric acid-etchant on shear bond strength (SBS), adhesive remnant index (ARI), and enamel morphology at different debonding time points. Materials and Methods: In this experimental study, 120 premolars were randomly divided into six groups of 20. In the first t...

2012
TORLEIF A. TOLLEFSEN

Au-Sn solid–liquid interdiffusion (SLID) bonding is a novel and promising interconnect technology for high-temperature applications. This article gives a review over previously published work on Au-Sn SLID bonding. An overview of the crystal phases and the thermomechanical properties of the Au-Sn phases relevant for Au-Sn SLID bonding is given. A summary of the bonding conditions used during Au...

Journal: :IEICE Transactions 2007
Ryo Takigawa Eiji Higurashi Tadatomo Suga Satoshi Shinada Tetsuya Kawanishi

A lithium niobate (LiNbO3)/silicon (Si) hybrid structure has been developed by the surface-activated bonding of LiNbO3 chips with gold (Au) thin film to Si substrates with patterned Au film. After organic contaminants on the Au surfaces were removed using argon radiofrequency plasma, Au-to-Au bonding was carried out in ambient air. Strong bonding at significantly low temperatures below 100◦C wi...

2012
Tak Yan Lee David P. P. Lok

The concept of bonding as a positive youth development construct is reviewed in this paper. The goals are fourfold. First, theoretical perspectives of bonding are delineated. Secondly, the relationships among bonding to caregivers, friends, romantic partners, as well as teachers, and adolescents' positive developmental outcomes are reviewed. Thirdly, with theoretical and empirical support, a di...

2017
Martin Breugst Daniel von der Heiden Julie Schmauck

Noncovalent interactions play an important role in many biological and chemical processes. Among these, hydrogen bonding is very well studied and is already routinely used in organocatalysis. This Short Review focuses on three other types of promising noncovalent interactions. Halogen bonding, chalcogen bonding, and anion-π bonding have been introduced into organocatalysis in the last few years...

Journal: :Microelectronics Reliability 2012
Ya-Sheng Tang Yao-Jen Chang Kuan-Neng Chen

0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.04.016 ⇑ Corresponding author. E-mail address: [email protected] (K.-N. C Semiconductor industry currently utilizes copper wafer bonding as one of key technologies for 3D integration. This review paper describes both science and technology of copper wafer bonding with regard to present applications. The classifi...

2016
K Mallikarjun Goud

Background: The old concept of total-etch/dry bonding has been superseded by total-etch/wet bonding, and later on by the self-etch systems. Manufacturers have introduced single bottle systems to be used in total-etch, self-etch, or selective-etch modes under both dry and moist conditions. The aim of this study was to evaluate shear bond strengths of three different dental adhesives under dry an...

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